Organo-soluble, segmented rigid-rod polyimide films: 2. Properties for microelectronic applications

Fred E. Arnold, Stephen Z.D. Cheng, Steven L.C. Hsu, Chul Joo Lee, Frank W. Harris, Suk Fai Lau

Research output: Contribution to journalArticlepeer-review

61 Citations (Scopus)

Abstract

The essential properties of polyimide films of importance in microelectronic applications are thermal and thermo-oxidative stability, dimensional stability, glass transition behaviour and the relative permittivity (dielectric constant ε′). A segmented rigid-rod polyimide was synthesized from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (PFMB) in order to develop new materials for microelectronic applications. The thermal and thermo-oxidative stability were investigated by determining the thermal degradation activation energy in air (210 kJ mol-1) and in nitrogen (303 kJ mol-1). The thermal stability was further studied through thermogravimetry-mass spectroscopy. The coefficient of thermal expansion, which indicates the dimensional stability, was measured via a tension mode of a thermomechanical analyser and doubly extrapolated to zero stresses, and was 6.98 × 10-6°C-1 for the BPDA-PFMB films. The glass transition temperature, measured thermomechanically, was found to be 287°C. The dielectric constant for the films, measured after ageing at 50% relative humidity for 48 h at 23°C, was between 2.8 and 2.9 in a frequency range from 0.1 kHz to 1 MHz. The temperature and frequency dependence of the dielectric behaviour is also discussed.

Original languageEnglish
Pages (from-to)5179-5185
Number of pages7
Journalpolymer
Volume33
Issue number24
DOIs
Publication statusPublished - 1992

All Science Journal Classification (ASJC) codes

  • Organic Chemistry
  • Polymers and Plastics
  • Materials Chemistry

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