TY - JOUR
T1 - Organo-soluble, segmented rigid-rod polyimide films
T2 - 2. Properties for microelectronic applications
AU - Arnold, Fred E.
AU - Cheng, Stephen Z.D.
AU - Hsu, Steven L.C.
AU - Lee, Chul Joo
AU - Harris, Frank W.
AU - Lau, Suk Fai
PY - 1992
Y1 - 1992
N2 - The essential properties of polyimide films of importance in microelectronic applications are thermal and thermo-oxidative stability, dimensional stability, glass transition behaviour and the relative permittivity (dielectric constant ε′). A segmented rigid-rod polyimide was synthesized from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (PFMB) in order to develop new materials for microelectronic applications. The thermal and thermo-oxidative stability were investigated by determining the thermal degradation activation energy in air (210 kJ mol-1) and in nitrogen (303 kJ mol-1). The thermal stability was further studied through thermogravimetry-mass spectroscopy. The coefficient of thermal expansion, which indicates the dimensional stability, was measured via a tension mode of a thermomechanical analyser and doubly extrapolated to zero stresses, and was 6.98 × 10-6°C-1 for the BPDA-PFMB films. The glass transition temperature, measured thermomechanically, was found to be 287°C. The dielectric constant for the films, measured after ageing at 50% relative humidity for 48 h at 23°C, was between 2.8 and 2.9 in a frequency range from 0.1 kHz to 1 MHz. The temperature and frequency dependence of the dielectric behaviour is also discussed.
AB - The essential properties of polyimide films of importance in microelectronic applications are thermal and thermo-oxidative stability, dimensional stability, glass transition behaviour and the relative permittivity (dielectric constant ε′). A segmented rigid-rod polyimide was synthesized from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (PFMB) in order to develop new materials for microelectronic applications. The thermal and thermo-oxidative stability were investigated by determining the thermal degradation activation energy in air (210 kJ mol-1) and in nitrogen (303 kJ mol-1). The thermal stability was further studied through thermogravimetry-mass spectroscopy. The coefficient of thermal expansion, which indicates the dimensional stability, was measured via a tension mode of a thermomechanical analyser and doubly extrapolated to zero stresses, and was 6.98 × 10-6°C-1 for the BPDA-PFMB films. The glass transition temperature, measured thermomechanically, was found to be 287°C. The dielectric constant for the films, measured after ageing at 50% relative humidity for 48 h at 23°C, was between 2.8 and 2.9 in a frequency range from 0.1 kHz to 1 MHz. The temperature and frequency dependence of the dielectric behaviour is also discussed.
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U2 - 10.1016/0032-3861(92)90798-2
DO - 10.1016/0032-3861(92)90798-2
M3 - Article
AN - SCOPUS:0000449772
SN - 0032-3861
VL - 33
SP - 5179
EP - 5185
JO - polymer
JF - polymer
IS - 24
ER -