Orientation characterization of columnar-grained aluminum at triple junctions

Chien Shun Yun, Kuan Tai Lui, Jui Chao Kuo

Research output: Contribution to journalArticlepeer-review

Abstract

In this study, we used the digital-image-correlation (DIC) technique to investigate microstrain distribution after 5% deformation. Electron backscatter diffraction (EBSD) was also investigated in the orientation maps at triple junctions for an aluminum polycrystal after annealing at 360°C for 5, 20, 40, and 80 min, respectively. The results of the strain distribution demonstrated that strong deformation heterogeneities occur in the form of macroscopic shear localizations and that the average orientation spread or misorientation increases during annealing. Further, grain boundary migration was observed even at grain boundaries with the smallest differences in the orientation spread.

Original languageEnglish
Pages (from-to)2493-2497
Number of pages5
JournalMaterials Transactions
Volume50
Issue number10
DOIs
Publication statusPublished - 2009 Oct

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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