Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test

Ying Ta Chiu, Kwang Lung Lin, Yi Shao Lai

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Microstructural evolution occurred in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder bump during electromigration. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) observations for 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints subjected to 5 kA/cm2 current stressing at 150 °C revealed a gradual orientation transformation of Ph grains from random textures toward (101) grains. We proposed that the combination of reducing the surface energy of Pb grain boundaries and resistance of the entire polycrystalline system are the driving force for the orientation transformation of Ph grains during an electromigration test.

Original languageEnglish
Pages (from-to)1877-1881
Number of pages5
JournalJournal of Materials Research
Volume23
Issue number7
DOIs
Publication statusPublished - 2008 Jul 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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