Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test

Ying Ta Chiu, Kwang-Lung Lin, Yi Shao Lai

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Microstructural evolution occurred in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder bump during electromigration. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) observations for 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints subjected to 5 kA/cm2 current stressing at 150 °C revealed a gradual orientation transformation of Ph grains from random textures toward (101) grains. We proposed that the combination of reducing the surface energy of Pb grain boundaries and resistance of the entire polycrystalline system are the driving force for the orientation transformation of Ph grains during an electromigration test.

Original languageEnglish
Pages (from-to)1877-1881
Number of pages5
JournalJournal of Materials Research
Volume23
Issue number7
DOIs
Publication statusPublished - 2008 Jul 1

Fingerprint

Electromigration
electromigration
solders
Soldering alloys
chips
composite materials
Composite materials
Microstructural evolution
Interfacial energy
Electron diffraction
surface energy
Grain boundaries
textures
grain boundaries
Textures
Scanning electron microscopy
scanning electron microscopy
diffraction
electrons

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

@article{66640e0d330249cba4d001d307e923ca,
title = "Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test",
abstract = "Microstructural evolution occurred in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder bump during electromigration. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) observations for 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints subjected to 5 kA/cm2 current stressing at 150 °C revealed a gradual orientation transformation of Ph grains from random textures toward (101) grains. We proposed that the combination of reducing the surface energy of Pb grain boundaries and resistance of the entire polycrystalline system are the driving force for the orientation transformation of Ph grains during an electromigration test.",
author = "Chiu, {Ying Ta} and Kwang-Lung Lin and Lai, {Yi Shao}",
year = "2008",
month = "7",
day = "1",
doi = "10.1557/jmr.2008.0227",
language = "English",
volume = "23",
pages = "1877--1881",
journal = "Journal of Materials Research",
issn = "0884-2914",
publisher = "Materials Research Society",
number = "7",

}

Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test. / Chiu, Ying Ta; Lin, Kwang-Lung; Lai, Yi Shao.

In: Journal of Materials Research, Vol. 23, No. 7, 01.07.2008, p. 1877-1881.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test

AU - Chiu, Ying Ta

AU - Lin, Kwang-Lung

AU - Lai, Yi Shao

PY - 2008/7/1

Y1 - 2008/7/1

N2 - Microstructural evolution occurred in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder bump during electromigration. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) observations for 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints subjected to 5 kA/cm2 current stressing at 150 °C revealed a gradual orientation transformation of Ph grains from random textures toward (101) grains. We proposed that the combination of reducing the surface energy of Pb grain boundaries and resistance of the entire polycrystalline system are the driving force for the orientation transformation of Ph grains during an electromigration test.

AB - Microstructural evolution occurred in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder bump during electromigration. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) observations for 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints subjected to 5 kA/cm2 current stressing at 150 °C revealed a gradual orientation transformation of Ph grains from random textures toward (101) grains. We proposed that the combination of reducing the surface energy of Pb grain boundaries and resistance of the entire polycrystalline system are the driving force for the orientation transformation of Ph grains during an electromigration test.

UR - http://www.scopus.com/inward/record.url?scp=48749104212&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=48749104212&partnerID=8YFLogxK

U2 - 10.1557/jmr.2008.0227

DO - 10.1557/jmr.2008.0227

M3 - Article

VL - 23

SP - 1877

EP - 1881

JO - Journal of Materials Research

JF - Journal of Materials Research

SN - 0884-2914

IS - 7

ER -