TY - JOUR
T1 - Packaging a fiber Bragg grating with metal coating for an athermal design
AU - Lo, Yu Lung
AU - Kuo, Chih Ping
N1 - Funding Information:
Manuscript received July 23, 2002; revised February 4, 2003. The work was supported in part by the Ministry of Education Program for Promoting Academic Excellence of Universities, Taiwan, R.O.C., under Grant A-91-E-FA08-1-4.
PY - 2003/5
Y1 - 2003/5
N2 - This paper presents an athermal package to compensate for temperature deviation of a fiber Bragg grating (FBG) with a metal coating. The metal coating is electroless plated onto the optical fiber to function as a thermal compensator. From the cross section of a thermal compensator used for FBG athermal package, an optical fiber and a metal coating appear. Therefore, in theory, the two-phase constant model is applied in designing the metal coating thickness associated with the effective thermal expansion coefficient and the effective Young's modulus in the composite thermal compensator. As a result, the total variation of Bragg wavelength over the temperature ranging from 30 to 80 °C is around 0.05 nm in a new package based upon the concept of a bimaterial device. To the authors' knowledge, the configuration proposed in this paper is probably the simplest bimaterial package design there is.
AB - This paper presents an athermal package to compensate for temperature deviation of a fiber Bragg grating (FBG) with a metal coating. The metal coating is electroless plated onto the optical fiber to function as a thermal compensator. From the cross section of a thermal compensator used for FBG athermal package, an optical fiber and a metal coating appear. Therefore, in theory, the two-phase constant model is applied in designing the metal coating thickness associated with the effective thermal expansion coefficient and the effective Young's modulus in the composite thermal compensator. As a result, the total variation of Bragg wavelength over the temperature ranging from 30 to 80 °C is around 0.05 nm in a new package based upon the concept of a bimaterial device. To the authors' knowledge, the configuration proposed in this paper is probably the simplest bimaterial package design there is.
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U2 - 10.1109/JLT.2003.810925
DO - 10.1109/JLT.2003.810925
M3 - Article
AN - SCOPUS:0041592559
SN - 0733-8724
VL - 21
SP - 1377
EP - 1383
JO - Journal of Lightwave Technology
JF - Journal of Lightwave Technology
IS - 5
ER -