Packaging a fiber bragg grating without preloading in a simple athermal bimaterial device

Yu-Lung Lo, Chih Ping Kuo

Research output: Contribution to journalArticle

26 Citations (Scopus)

Abstract

This study presents two athermal packages for compensating for the temperature deviations in an optical fiber Bragg grating (FBG). Usually, a pre-loading mechanism is necessary in packaging the FBG onto bimaterial devices. However, through a unique bonding process design, the pre-loading mechanism in the packaging could be eliminated. During the manufacturing processes, AB thermally cured adhesive is used to affix the FBG to the device under a thermal state. In this way, the FBG affixed to the devices will be under tension when the temperature drops to room temperature. The devices can also be placed continuously under a thermal state after a thermal curing process for a pre-determined period of time to perform annealing on the FBG, and thereby, further simplifying the manufacturing process. As a result, the total variation in the Bragg wavelength over the range from -40 to +80 °C were around 0.1 nm in the two proposed athermal packages.

Original languageEnglish
Pages (from-to)50-53
Number of pages4
JournalIEEE Transactions on Advanced Packaging
Volume25
Issue number1
DOIs
Publication statusPublished - 2002 Feb 1

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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