Packaging a fiber bragg grating without preloading in a simple athermal bimaterial device

Yu Lung Lo; Chih Ping Kuo

doi:10.1109/TADVP.2002.1017685

Packaging a fiber bragg grating without preloading in a simple athermal bimaterial device

Yu Lung Lo, Chih Ping Kuo

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

28 Citations (Scopus)

Abstract

This study presents two athermal packages for compensating for the temperature deviations in an optical fiber Bragg grating (FBG). Usually, a pre-loading mechanism is necessary in packaging the FBG onto bimaterial devices. However, through a unique bonding process design, the pre-loading mechanism in the packaging could be eliminated. During the manufacturing processes, AB thermally cured adhesive is used to affix the FBG to the device under a thermal state. In this way, the FBG affixed to the devices will be under tension when the temperature drops to room temperature. The devices can also be placed continuously under a thermal state after a thermal curing process for a pre-determined period of time to perform annealing on the FBG, and thereby, further simplifying the manufacturing process. As a result, the total variation in the Bragg wavelength over the range from -40 to +80 °C were around 0.1 nm in the two proposed athermal packages.

Original language	English
Pages (from-to)	50-53
Number of pages	4
Journal	IEEE Transactions on Advanced Packaging
Volume	25
Issue number	1
DOIs	https://doi.org/10.1109/TADVP.2002.1017685
Publication status	Published - 2002 Feb

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/TADVP.2002.1017685

Cite this

@article{e8ce29661c5742708ab026d031997da6,

title = "Packaging a fiber bragg grating without preloading in a simple athermal bimaterial device",

abstract = "This study presents two athermal packages for compensating for the temperature deviations in an optical fiber Bragg grating (FBG). Usually, a pre-loading mechanism is necessary in packaging the FBG onto bimaterial devices. However, through a unique bonding process design, the pre-loading mechanism in the packaging could be eliminated. During the manufacturing processes, AB thermally cured adhesive is used to affix the FBG to the device under a thermal state. In this way, the FBG affixed to the devices will be under tension when the temperature drops to room temperature. The devices can also be placed continuously under a thermal state after a thermal curing process for a pre-determined period of time to perform annealing on the FBG, and thereby, further simplifying the manufacturing process. As a result, the total variation in the Bragg wavelength over the range from -40 to +80 °C were around 0.1 nm in the two proposed athermal packages.",

author = "Lo, {Yu Lung} and Kuo, {Chih Ping}",

year = "2002",

month = feb,

doi = "10.1109/TADVP.2002.1017685",

language = "English",

volume = "25",

pages = "50--53",

journal = "IEEE Transactions on Advanced Packaging",

issn = "1521-3323",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "1",

}

TY - JOUR

T1 - Packaging a fiber bragg grating without preloading in a simple athermal bimaterial device

AU - Lo, Yu Lung

AU - Kuo, Chih Ping

PY - 2002/2

Y1 - 2002/2

N2 - This study presents two athermal packages for compensating for the temperature deviations in an optical fiber Bragg grating (FBG). Usually, a pre-loading mechanism is necessary in packaging the FBG onto bimaterial devices. However, through a unique bonding process design, the pre-loading mechanism in the packaging could be eliminated. During the manufacturing processes, AB thermally cured adhesive is used to affix the FBG to the device under a thermal state. In this way, the FBG affixed to the devices will be under tension when the temperature drops to room temperature. The devices can also be placed continuously under a thermal state after a thermal curing process for a pre-determined period of time to perform annealing on the FBG, and thereby, further simplifying the manufacturing process. As a result, the total variation in the Bragg wavelength over the range from -40 to +80 °C were around 0.1 nm in the two proposed athermal packages.

AB - This study presents two athermal packages for compensating for the temperature deviations in an optical fiber Bragg grating (FBG). Usually, a pre-loading mechanism is necessary in packaging the FBG onto bimaterial devices. However, through a unique bonding process design, the pre-loading mechanism in the packaging could be eliminated. During the manufacturing processes, AB thermally cured adhesive is used to affix the FBG to the device under a thermal state. In this way, the FBG affixed to the devices will be under tension when the temperature drops to room temperature. The devices can also be placed continuously under a thermal state after a thermal curing process for a pre-determined period of time to perform annealing on the FBG, and thereby, further simplifying the manufacturing process. As a result, the total variation in the Bragg wavelength over the range from -40 to +80 °C were around 0.1 nm in the two proposed athermal packages.

UR - http://www.scopus.com/inward/record.url?scp=0036478891&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036478891&partnerID=8YFLogxK

U2 - 10.1109/TADVP.2002.1017685

DO - 10.1109/TADVP.2002.1017685

M3 - Article

AN - SCOPUS:0036478891

SN - 1521-3323

VL - 25

SP - 50

EP - 53

JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

IS - 1

ER -

Packaging a fiber bragg grating without preloading in a simple athermal bimaterial device

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this