Phase transformation and microstructural evolution in solder joints

Sinn Wen Chen; Chao Hong Wang; Shih Kang Lin; Chen Nan Chiu; Chih Chi Chen

doi:10.1007/s11837-007-0008-5

Phase transformation and microstructural evolution in solder joints

Sinn Wen Chen, Chao Hong Wang, Shih Kang Lin, Chen Nan Chiu, Chih Chi Chen

Department of Materials Science and Engineering

Research output: Contribution to journal › Review article › peer-review

15 Citations (Scopus)

Abstract

Soldering is the most important of joining technologies and there are numerous solder joints in modern electronic products. The phases and microstructures of solder joints are critical to their properties. Various remarkable phenomena caused by phase transformation and microstructural evolution in solder joints have been reported. The phenomena include ripening, layer detachment, liquation, cruciform pattern formation, solid-state amorphization, alternating layer formation, shift of reaction paths, and the effects of electromigration.

Original language	English
Pages (from-to)	39-43
Number of pages	5
Journal	JOM
Volume	59
Issue number	1
DOIs	https://doi.org/10.1007/s11837-007-0008-5
Publication status	Published - 2007 Jan

All Science Journal Classification (ASJC) codes

General Materials Science
General Engineering

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10.1007/s11837-007-0008-5

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title = "Phase transformation and microstructural evolution in solder joints",

abstract = "Soldering is the most important of joining technologies and there are numerous solder joints in modern electronic products. The phases and microstructures of solder joints are critical to their properties. Various remarkable phenomena caused by phase transformation and microstructural evolution in solder joints have been reported. The phenomena include ripening, layer detachment, liquation, cruciform pattern formation, solid-state amorphization, alternating layer formation, shift of reaction paths, and the effects of electromigration.",

author = "Chen, {Sinn Wen} and Wang, {Chao Hong} and Lin, {Shih Kang} and Chiu, {Chen Nan} and Chen, {Chih Chi}",

note = "Funding Information: The authors acknowledge the financial support of National Science Council of Taiwan (Grant NSC95-2218-E-007- 028).",

year = "2007",

month = jan,

doi = "10.1007/s11837-007-0008-5",

language = "English",

volume = "59",

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issn = "1047-4838",

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T1 - Phase transformation and microstructural evolution in solder joints

AU - Chen, Sinn Wen

AU - Wang, Chao Hong

AU - Lin, Shih Kang

AU - Chiu, Chen Nan

AU - Chen, Chih Chi

N1 - Funding Information: The authors acknowledge the financial support of National Science Council of Taiwan (Grant NSC95-2218-E-007- 028).

PY - 2007/1

Y1 - 2007/1

N2 - Soldering is the most important of joining technologies and there are numerous solder joints in modern electronic products. The phases and microstructures of solder joints are critical to their properties. Various remarkable phenomena caused by phase transformation and microstructural evolution in solder joints have been reported. The phenomena include ripening, layer detachment, liquation, cruciform pattern formation, solid-state amorphization, alternating layer formation, shift of reaction paths, and the effects of electromigration.

AB - Soldering is the most important of joining technologies and there are numerous solder joints in modern electronic products. The phases and microstructures of solder joints are critical to their properties. Various remarkable phenomena caused by phase transformation and microstructural evolution in solder joints have been reported. The phenomena include ripening, layer detachment, liquation, cruciform pattern formation, solid-state amorphization, alternating layer formation, shift of reaction paths, and the effects of electromigration.

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U2 - 10.1007/s11837-007-0008-5

DO - 10.1007/s11837-007-0008-5

M3 - Review article

AN - SCOPUS:33846482155

SN - 1047-4838

VL - 59

SP - 39

EP - 43

JO - JOM

JF - JOM

IS - 1

ER -

Phase transformation and microstructural evolution in solder joints

Abstract

All Science Journal Classification (ASJC) codes

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