Phase transformation and microstructural evolution in solder joints

Sinn Wen Chen, Chao Hong Wang, Shih Kang Lin, Chen Nan Chiu, Chih Chi Chen

Research output: Contribution to journalReview articlepeer-review

14 Citations (Scopus)

Abstract

Soldering is the most important of joining technologies and there are numerous solder joints in modern electronic products. The phases and microstructures of solder joints are critical to their properties. Various remarkable phenomena caused by phase transformation and microstructural evolution in solder joints have been reported. The phenomena include ripening, layer detachment, liquation, cruciform pattern formation, solid-state amorphization, alternating layer formation, shift of reaction paths, and the effects of electromigration.

Original languageEnglish
Pages (from-to)39-43
Number of pages5
JournalJOM
Volume59
Issue number1
DOIs
Publication statusPublished - 2007 Jan

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

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