Phenomenological model for "stress memorization" effect from a capped-poly process

L. S. Adam, C. Chiu, M. Huang, X. Wang, Y. Wang, S. Singh, Y. Chen, H. Bu, J. Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

NMOSFET drive current improvement by a disposable Stressor or a capped-poly process has been reported recently in the literature[1]. The retained drive current gain even after the removal of the Stressor film is attributed to a stress "memorization" effect. A phenomenological model and numerical simulations showing the memorized stress are reported for the first time in this paper. An irreversible shape change of the polysilicon gate during the process is simulated by a plastic deformation model and the final resulting channel stress and associated Ids gain are analyzed.

Original languageEnglish
Title of host publication2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005
Pages139-142
Number of pages4
Publication statusPublished - 2005 Dec 1
Event2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005 - Tokyo, Japan
Duration: 2005 Sep 12005 Sep 3

Publication series

NameInternational Conference on Simulation of Semiconductor Processes and Devices, SISPAD
Volume2005

Other

Other2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005
CountryJapan
CityTokyo
Period05-09-0105-09-03

Fingerprint

Polysilicon
Plastic deformation
Computer simulation

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Adam, L. S., Chiu, C., Huang, M., Wang, X., Wang, Y., Singh, S., ... Wu, J. (2005). Phenomenological model for "stress memorization" effect from a capped-poly process. In 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005 (pp. 139-142). [1562044] (International Conference on Simulation of Semiconductor Processes and Devices, SISPAD; Vol. 2005).
Adam, L. S. ; Chiu, C. ; Huang, M. ; Wang, X. ; Wang, Y. ; Singh, S. ; Chen, Y. ; Bu, H. ; Wu, J. / Phenomenological model for "stress memorization" effect from a capped-poly process. 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005. 2005. pp. 139-142 (International Conference on Simulation of Semiconductor Processes and Devices, SISPAD).
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abstract = "NMOSFET drive current improvement by a disposable Stressor or a capped-poly process has been reported recently in the literature[1]. The retained drive current gain even after the removal of the Stressor film is attributed to a stress {"}memorization{"} effect. A phenomenological model and numerical simulations showing the memorized stress are reported for the first time in this paper. An irreversible shape change of the polysilicon gate during the process is simulated by a plastic deformation model and the final resulting channel stress and associated Ids gain are analyzed.",
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Adam, LS, Chiu, C, Huang, M, Wang, X, Wang, Y, Singh, S, Chen, Y, Bu, H & Wu, J 2005, Phenomenological model for "stress memorization" effect from a capped-poly process. in 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005., 1562044, International Conference on Simulation of Semiconductor Processes and Devices, SISPAD, vol. 2005, pp. 139-142, 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005, Tokyo, Japan, 05-09-01.

Phenomenological model for "stress memorization" effect from a capped-poly process. / Adam, L. S.; Chiu, C.; Huang, M.; Wang, X.; Wang, Y.; Singh, S.; Chen, Y.; Bu, H.; Wu, J.

2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005. 2005. p. 139-142 1562044 (International Conference on Simulation of Semiconductor Processes and Devices, SISPAD; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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T1 - Phenomenological model for "stress memorization" effect from a capped-poly process

AU - Adam, L. S.

AU - Chiu, C.

AU - Huang, M.

AU - Wang, X.

AU - Wang, Y.

AU - Singh, S.

AU - Chen, Y.

AU - Bu, H.

AU - Wu, J.

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N2 - NMOSFET drive current improvement by a disposable Stressor or a capped-poly process has been reported recently in the literature[1]. The retained drive current gain even after the removal of the Stressor film is attributed to a stress "memorization" effect. A phenomenological model and numerical simulations showing the memorized stress are reported for the first time in this paper. An irreversible shape change of the polysilicon gate during the process is simulated by a plastic deformation model and the final resulting channel stress and associated Ids gain are analyzed.

AB - NMOSFET drive current improvement by a disposable Stressor or a capped-poly process has been reported recently in the literature[1]. The retained drive current gain even after the removal of the Stressor film is attributed to a stress "memorization" effect. A phenomenological model and numerical simulations showing the memorized stress are reported for the first time in this paper. An irreversible shape change of the polysilicon gate during the process is simulated by a plastic deformation model and the final resulting channel stress and associated Ids gain are analyzed.

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M3 - Conference contribution

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SN - 4990276205

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BT - 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005

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Adam LS, Chiu C, Huang M, Wang X, Wang Y, Singh S et al. Phenomenological model for "stress memorization" effect from a capped-poly process. In 2005 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2005. 2005. p. 139-142. 1562044. (International Conference on Simulation of Semiconductor Processes and Devices, SISPAD).