TY - GEN
T1 - Physical aging of epoxy molding compound and its influences on the warpage of reconstituted wafer
AU - Chiu, Tz Cheng
AU - Yin, Wei Jie
AU - Yeh, En Yu
AU - Yang, Yu Ting
AU - Chen, Dao Long
AU - Tseng, Yi Hsiu
N1 - Funding Information:
ACKNOWLEDGMENT This study was partially sponsored by the National Science Council of R.O.C. under the grant NSC 106-2221-E-006-023 and by the ASE Group. Equipment and materials support from ASE for the experimental characterizations are much appreciated.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/8/7
Y1 - 2018/8/7
N2 - Epoxy molding compound (EMC) is a key constituent in large overmolded panel or wafer. During various packaging thermal processes, the thermal expansion mismatch between EMC and Si die and the shrinkage of EMC due to chemical or physical aging would lead to residual stress and warpage. For accurately predicting warpage in fan-out reconstituted wafer, the viscoelastic constitutive behavior and the physical aging characteristics were investigated. The viscoelastic behavior of the EMC were measured by quasi-static relaxation and creep experiments. Consistency of the viscoelastic behaviors measured from these two experiments were examined and compared to the viscoelastic model constructed from time-harmonic dynamic experiment. From the comparisons of these test results, it was found that the viscoelastic behavior measured by creep and relaxation tests are highly consistent, and the presence of physical aging in the dynamic test specimen delays the viscoelastic relaxation. In addition, physical aging leads to stress-free shrinkage comparable to the chemical-aging induced shrinkage. The chemical-thermomechanical constitutive model was also implemented to simulate warpage evolution of a reconstituted wafer.
AB - Epoxy molding compound (EMC) is a key constituent in large overmolded panel or wafer. During various packaging thermal processes, the thermal expansion mismatch between EMC and Si die and the shrinkage of EMC due to chemical or physical aging would lead to residual stress and warpage. For accurately predicting warpage in fan-out reconstituted wafer, the viscoelastic constitutive behavior and the physical aging characteristics were investigated. The viscoelastic behavior of the EMC were measured by quasi-static relaxation and creep experiments. Consistency of the viscoelastic behaviors measured from these two experiments were examined and compared to the viscoelastic model constructed from time-harmonic dynamic experiment. From the comparisons of these test results, it was found that the viscoelastic behavior measured by creep and relaxation tests are highly consistent, and the presence of physical aging in the dynamic test specimen delays the viscoelastic relaxation. In addition, physical aging leads to stress-free shrinkage comparable to the chemical-aging induced shrinkage. The chemical-thermomechanical constitutive model was also implemented to simulate warpage evolution of a reconstituted wafer.
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U2 - 10.1109/ECTC.2018.00277
DO - 10.1109/ECTC.2018.00277
M3 - Conference contribution
AN - SCOPUS:85051925737
SN - 9781538649985
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1848
EP - 1855
BT - Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 68th IEEE Electronic Components and Technology Conference, ECTC 2018
Y2 - 29 May 2018 through 1 June 2018
ER -