Physical characteristics of polyimide films for flexible sensors

Wen Yang Chang, Te Hua Fang, Yu Cheng Lin

Research output: Contribution to journalArticlepeer-review

37 Citations (Scopus)


Physical characteristics of polyimide films, including optical, micro/nano mechanical, and thermophysical characteristics were investigated using a photometric, a nanoindentation, and a thermomechanical analyzer for applications in flexible sensors. Experimental results show that UV light cannot transmit into the polyimide films. The transmittances, with a maximum of about 86%, at VIS and near IR lights decrease with increasing PI film thicknesses. The mechanical characteristics were determined using tensile, bending moment, and nanoindentation testing. The stress-strain curve approximated bilinear characteristics, the load-unload bending moment exhibited hysteresis, and nanoindentation generated elastic energy dissipation in the loading-unloading region. Nanoindentation showed an almost uniform hardness and a reduced Young's modulus of about 0.181±0.03 and 3.21±0.06 GPa, respectively, when the penetrating depth was more than about 2 μm. Thermophysical characteristics were greatly influenced on 8.3 and 25 μm specimens due to the higher relaxation of thin PI films. The thermal expansion remained steady when the thickness was over 50 μm. The results show that PI films have potential in flexible sensing and higher temperature fabrication.

Original languageEnglish
Pages (from-to)693-701
Number of pages9
JournalApplied Physics A: Materials Science and Processing
Issue number3
Publication statusPublished - 2008 Aug 1

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Science(all)


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