Placement with reliability and wirability for power hybrid circuits

Jing Lee, Jung Hua Chou, Shen Li Fu

Research output: Contribution to conferencePaper

Abstract

This paper develops a placement procedure based a divide-and-conquer strategy for power hybrid circuits. In this method, the components with higher heat dissipation rate are evenly distributed apart, thus both the maximum temperature and the maximum temperature variation on the substrate are reduced. For other components the placement objective is to optimize the wirability. Since this placement procedure considers both reliability and routability together, it improves the circuit reliability, and only slightly increases the total wiring lengths when compares to the force directed placement algorithm.

Original languageEnglish
Pages915-920
Number of pages6
Publication statusPublished - 1995 Jan 1
EventProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA
Duration: 1995 Mar 261995 Mar 30

Other

OtherProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)
CityMaui, HI, USA
Period95-03-2695-03-30

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Lee, J., Chou, J. H., & Fu, S. L. (1995). Placement with reliability and wirability for power hybrid circuits. 915-920. Paper presented at Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2), Maui, HI, USA, .