@inproceedings{f9047c76e4c14b45b57cfbabc23f9195,
title = "Plasma resistance and behavior of polybenzoxazine polymer",
abstract = "The structure of B-a type polybenzoxazine(PBZZ) is similar to phenolic resin through thermal self-curing of the heterocyclic ring opening reaction that neither requires catalyst nor releases any condensation byproduct. These PBZZ resins are found to possess several outstanding properties such as near no shrinkage after curing, high thermal stability and low water absorption. Furthermore, the PBZZ has high glass transition temperature even though it has relatively low cross linking density. Hence, the PBZZ polymer is a candidate material for IC manufacturing. The plasma treatment of this polymer is reported here.",
author = "Chen, {Jem Kun} and Kuang-I Lin and Ko, {Fu Hsiang} and Chang, {Feng Chih} and Chen, {Feng Chih}",
year = "2003",
month = jan,
day = "1",
doi = "10.1109/IMNC.2003.1268745",
language = "English",
series = "Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "260--261",
booktitle = "Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003",
address = "United States",
note = "International Microprocesses and Nanotechnology Conference, MNC 2003 ; Conference date: 29-10-2003 Through 31-10-2003",
}