Plasma resistance and behavior of polybenzoxazine polymer

Jem Kun Chen, Kuang-I Lin, Fu Hsiang Ko, Feng Chih Chang, Feng Chih Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The structure of B-a type polybenzoxazine(PBZZ) is similar to phenolic resin through thermal self-curing of the heterocyclic ring opening reaction that neither requires catalyst nor releases any condensation byproduct. These PBZZ resins are found to possess several outstanding properties such as near no shrinkage after curing, high thermal stability and low water absorption. Furthermore, the PBZZ has high glass transition temperature even though it has relatively low cross linking density. Hence, the PBZZ polymer is a candidate material for IC manufacturing. The plasma treatment of this polymer is reported here.

Original languageEnglish
Title of host publicationDigest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages260-261
Number of pages2
ISBN (Electronic)4891140402, 9784891140403
DOIs
Publication statusPublished - 2003 Jan 1
EventInternational Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan
Duration: 2003 Oct 292003 Oct 31

Publication series

NameDigest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003

Conference

ConferenceInternational Microprocesses and Nanotechnology Conference, MNC 2003
CountryJapan
CityTokyo
Period03-10-2903-10-31

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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