Plasma treatment on the plastic substrates for liquid phase deposited SiO2 films for flexible electronics applications

Yu Ju Lin; Chih Chieh Yeh; Li Ming Huang; Ten Chin Wen; Yeong Her Wang

doi:10.1109/ICSICT.2006.306563

Plasma treatment on the plastic substrates for liquid phase deposited SiO₂ films for flexible electronics applications

Yu Ju Lin, Chih Chieh Yeh, Li Ming Huang, Ten Chin Wen, Yeong Her Wang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Liquid phase deposition (LPD) method to grow the silicon dioxide interlayer on the PES plastic substrates with the O₂/Ar plasma pre-treatment is investigated. After which, the interlayer on the plastic substrates is grown and the films' quality on the substrates with or without the plasma pre-treatment is examined by using scanning electron microscopy, etching rate of the oxide layer by the diluted HF solution and surface leakage current measurement. The pentacene-based organic thin film transistors on the dielectric layers suitable for flexible electronics applications are demonstrated.

Original language	English
Title of host publication	ICSICT-2006
Subtitle of host publication	2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings
Publisher	IEEE Computer Society
Pages	893-895
Number of pages	3
ISBN (Print)	1424401615, 9781424401611
DOIs	https://doi.org/10.1109/ICSICT.2006.306563
Publication status	Published - 2006 Jan 1
Event	ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology - Shanghai, China Duration: 2006 Oct 23 → 2006 Oct 26

Publication series

Name	ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings

Other

Other	ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology
Country/Territory	China
City	Shanghai
Period	06-10-23 → 06-10-26

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/ICSICT.2006.306563

Cite this

Lin, Y. J., Yeh, C. C., Huang, L. M., Wen, T. C., & Wang, Y. H. (2006). Plasma treatment on the plastic substrates for liquid phase deposited SiO₂ films for flexible electronics applications. In ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings (pp. 893-895). Article 4098268 (ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings). IEEE Computer Society. https://doi.org/10.1109/ICSICT.2006.306563

Lin, Yu Ju ; Yeh, Chih Chieh ; Huang, Li Ming et al. / Plasma treatment on the plastic substrates for liquid phase deposited SiO₂ films for flexible electronics applications. ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings. IEEE Computer Society, 2006. pp. 893-895 (ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings).

@inproceedings{da0851046a82453fb2fb7cda6d2f9b25,

title = "Plasma treatment on the plastic substrates for liquid phase deposited SiO2 films for flexible electronics applications",

abstract = "Liquid phase deposition (LPD) method to grow the silicon dioxide interlayer on the PES plastic substrates with the O2/Ar plasma pre-treatment is investigated. After which, the interlayer on the plastic substrates is grown and the films' quality on the substrates with or without the plasma pre-treatment is examined by using scanning electron microscopy, etching rate of the oxide layer by the diluted HF solution and surface leakage current measurement. The pentacene-based organic thin film transistors on the dielectric layers suitable for flexible electronics applications are demonstrated.",

author = "Lin, {Yu Ju} and Yeh, {Chih Chieh} and Huang, {Li Ming} and Wen, {Ten Chin} and Wang, {Yeong Her}",

year = "2006",

month = jan,

day = "1",

doi = "10.1109/ICSICT.2006.306563",

language = "English",

isbn = "1424401615",

series = "ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings",

publisher = "IEEE Computer Society",

pages = "893--895",

booktitle = "ICSICT-2006",

address = "United States",

note = "ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology ; Conference date: 23-10-2006 Through 26-10-2006",

}

Lin, YJ, Yeh, CC, Huang, LM, Wen, TC & Wang, YH 2006, Plasma treatment on the plastic substrates for liquid phase deposited SiO₂ films for flexible electronics applications. in ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings., 4098268, ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings, IEEE Computer Society, pp. 893-895, ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Shanghai, China, 06-10-23. https://doi.org/10.1109/ICSICT.2006.306563

Plasma treatment on the plastic substrates for liquid phase deposited SiO₂ films for flexible electronics applications. / Lin, Yu Ju; Yeh, Chih Chieh; Huang, Li Ming et al.
ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings. IEEE Computer Society, 2006. p. 893-895 4098268 (ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Plasma treatment on the plastic substrates for liquid phase deposited SiO2 films for flexible electronics applications

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N2 - Liquid phase deposition (LPD) method to grow the silicon dioxide interlayer on the PES plastic substrates with the O2/Ar plasma pre-treatment is investigated. After which, the interlayer on the plastic substrates is grown and the films' quality on the substrates with or without the plasma pre-treatment is examined by using scanning electron microscopy, etching rate of the oxide layer by the diluted HF solution and surface leakage current measurement. The pentacene-based organic thin film transistors on the dielectric layers suitable for flexible electronics applications are demonstrated.

AB - Liquid phase deposition (LPD) method to grow the silicon dioxide interlayer on the PES plastic substrates with the O2/Ar plasma pre-treatment is investigated. After which, the interlayer on the plastic substrates is grown and the films' quality on the substrates with or without the plasma pre-treatment is examined by using scanning electron microscopy, etching rate of the oxide layer by the diluted HF solution and surface leakage current measurement. The pentacene-based organic thin film transistors on the dielectric layers suitable for flexible electronics applications are demonstrated.

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Lin YJ, Yeh CC, Huang LM, Wen TC , Wang YH. Plasma treatment on the plastic substrates for liquid phase deposited SiO₂ films for flexible electronics applications. In ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings. IEEE Computer Society. 2006. p. 893-895. 4098268. (ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings). doi: 10.1109/ICSICT.2006.306563