Pneumatically bidirectional microfluidic regulation using venturi pumps by deep RIE and bonding technology

Chen-Kuei Chung, W. J. Chang, Y. F. Kuo, C. L. Hsiao, K. Y. Weng

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A novel design for bidirectional fluidic motion has been demonstrated which is widely used in the biochip or microfluidic component. Two miniaturized Venturi pumps as well as pneumatic servo system are designed to easily control the bidirectional fluidic motion by simple fabrication. The pumping velocity is 0.86 μl/min at a 2.75 slpm (standard liter per minute) air flow read from mass flow controller (MFC) for totally 4.3 μl blue ink in a 300 μm wide by 300 μm deep channel. The higher airflow, the faster fluidic pumping speed. Numerical simulation is performed to correlate the experimental data of fluidic speed and air flow in microchannel. The test chip with two Venturi pumps and channel was batchedly fabricated by silicon deep reactive ion etching (RIE) and glass anodic bonding. The ICP LIGA process is also investigated after deep RIE followed the electroforming and hot embossing.

Original languageEnglish
Pages (from-to)318-322
Number of pages5
JournalMicrosystem Technologies
Volume8
Issue number4-5
DOIs
Publication statusPublished - 2002 Jan 1

Fingerprint

fluidics
Reactive ion etching
Fluidics
Microfluidics
etching
Pumps
pumps
air flow
ions
pumping
Electroforming
electroforming
Biochips
embossing
pneumatics
mass flow
Servomechanisms
inks
Silicon
Air

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Chung, Chen-Kuei ; Chang, W. J. ; Kuo, Y. F. ; Hsiao, C. L. ; Weng, K. Y. / Pneumatically bidirectional microfluidic regulation using venturi pumps by deep RIE and bonding technology. In: Microsystem Technologies. 2002 ; Vol. 8, No. 4-5. pp. 318-322.
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Pneumatically bidirectional microfluidic regulation using venturi pumps by deep RIE and bonding technology. / Chung, Chen-Kuei; Chang, W. J.; Kuo, Y. F.; Hsiao, C. L.; Weng, K. Y.

In: Microsystem Technologies, Vol. 8, No. 4-5, 01.01.2002, p. 318-322.

Research output: Contribution to journalArticle

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