Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn-9Zn/Cu sandwich

Shih Ming Kuo, Kwang Lung Lin

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8 Citations (Scopus)

Abstract

This study investigated the polarity effect of electromigration (EM) on the interfacial intermetallic compounds (IMCs) (γ-Cu5Zn8, Cu6Sn5) formation at the anode and the cathode in a Cu/Sn-9Zn/Cu sandwich with a constant direct current density of 1.0 × 103 A/cm2 at 100 °C. The EM had different polarity effects on the nucleation and growth rates of the interfacial Cu5Zn8 IMC from those of Cu6Sn5 IMC. Upon current stressing, the growth rate of the Cu-Zn intermetallic compound (γ-Cu5Zn8) at the cathode interface was much faster than that at the anode. However, the nucleation and growth of the Cu6Sn5 IMC at the anode interface were enhanced, though retarded at the cathode, under the influence of electric current. The mechanism of EM-induced Cu6Sn5 IMC formation towards the anodic Cu is also discussed.

Original languageEnglish
Pages (from-to)1087-1094
Number of pages8
JournalJournal of Materials Research
Volume23
Issue number4
DOIs
Publication statusPublished - 2008 Apr 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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