Post-Buckling Analysis for Addressing Asymmetric Warping of Fan-Out Reconstitution Process

Chia Yu Chen, Yu Ching Lee, Kuo Shen Chen, Dao Long Chen, Yu Xuan Lin, Wei Hong Lai, Hung Chun Yang, Tang Yuan Chen, Ching Jenq Ho, Chin Li Kao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Fan-out reconstitution process involves numerous thermal cycling and significant wafer warping would inevitable occur and full scale simulations are thus usually required for properly optimizing design and process parameters. However, the present nonlinear finite element approach of predicting wafer asymmetric warpage could result in extra computational cost and alternative approach might be worth to explore for performing efficient simulations. Thus, this work proposes a buckling/post-buckling scheme as a potential alternative for studying wafer warping problem and applies the schemes in real packaging process for demonstrating the feasibility and potentials of the approach. The simulation shows that the errors of bifurcation temperature and warpage of the two analyses are 14% and 6%, respectively w.r.t. nonlinear simulation thus the deviations are within acceptable range. Subsequently, process emulator with buckling/post-buckling analysis is established to predict warpage in the large deformation region. And compare with the nonlinear analysis, the error of warpage is within 3%. In the future, more numerical models are discussed to analyze the sensitivity of parameters thus the deformation behavior of actual process can be described more realistically.

Original languageEnglish
Title of host publication2023 International Conference on Electronics Packaging, ICEP 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages265-266
Number of pages2
ISBN (Electronic)9784991191152
DOIs
Publication statusPublished - 2023
Event22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan
Duration: 2023 Apr 192023 Apr 22

Publication series

Name2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference22nd International Conference on Electronics Packaging, ICEP 2023
Country/TerritoryJapan
CityKumamoto
Period23-04-1923-04-22

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Mechanics of Materials
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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