Post-mold cure process simulation of IC packaging

Chi Hong Shue, Sheng Jye Hwang, Huei Huang Lee, Dum Yuan Huang, Yao Jung Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Epoxy molding compound (EMC) is a common material used in IC packaging. One of its defects is warpage. Warpage could be a serious issue for some IC encapsulation processes. To alleviate the warpage problem during encapsulation, post mold cure process (PMC) is the most common strategy used. However, there are still no adequate tools or models to simulate the post mold cure process. Since EMC behaves like a viscoelastic material during post mold cure process, a viscoelastic model must be considered. The object of this paper was to construct a correct viscoelastic model, and then to input this model into a software package. This study adopted a dualistic shift factor Maxwell Model to simulate the post mold cure process. With this model, the amount of warpage after PMC process could be predicted. With dynamic mechanical analyzer (DMA) testing, the Generalized Maxwell model and Williams-Landel-Ferry (WLF) equation of fully cured EMC under different temperatures could be derived. Then, the partially cured EMC was tested by DMA. The viscoelastic properties of partially cured EMC were considered to have the similar behavior as temperature. Thus, a new model considering partially cured EMC as a cure induced shift factor similar to temperature shift factor could be derived. This model then became a model with dualistic shift factor Maxwell model. With some modification of structure analysis tool such as ANSYS, this dualistic shift factor Maxwell model could be applied and predict the post mold cure behavior of EMC. The results of calculation showed reasonable agreement between experiments and simulation.

Original languageEnglish
Title of host publication2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages106-110
Number of pages5
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan
Duration: 2008 Oct 222008 Oct 24

Publication series

Name2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Other

Other2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
CountryTaiwan
CityTaipei
Period08-10-2208-10-24

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Post-mold cure process simulation of IC packaging'. Together they form a unique fingerprint.

  • Cite this

    Shue, C. H., Hwang, S. J., Lee, H. H., Huang, D. Y., & Lee, Y. J. (2008). Post-mold cure process simulation of IC packaging. In 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 (pp. 106-110). [4784241] (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008). https://doi.org/10.1109/EMAP.2008.4784241