Prediction of flow induced lead deflection of leadframe assemblies in plastic encapsulation during molding
- J. Y. Chen
- , S. Y. Teng
- , S. J. Hwang
- , H. H. Lee
- , D. Y. Huang
- , Y. J. Lin
- , Stoke Chen
- , G. S. Shen
- , Lily Wu
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution