This study is to develop a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused by pressure difference and viscous stress during molding through the help of a true three-dimensional (3-D) Computational Fluid Dynamics (CFD) software.
|Number of pages||9|
|Journal||IEEE Transactions on Components and Packaging Technologies|
|Publication status||Published - 2000 Dec 1|
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering