Prediction of paddle shift via 3-D TSOP modeling

Francis Su, Sheng Jye Hwang, Huei Huang Lee, Durn Yuan Huang

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

This study is to develop a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused by pressure difference and viscous stress during molding through the help of a true three-dimensional (3-D) Computational Fluid Dynamics (CFD) software.

Original languageEnglish
Pages (from-to)684-692
Number of pages9
JournalIEEE Transactions on Components and Packaging Technologies
Volume23
Issue number4
DOIs
Publication statusPublished - 2000 Dec 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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