Predictions of shape and temperature for heating elements in an electronic package by inverse heat transfer method

Chin Hsiang Cheng, Mei Hsia Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The aim of this study is to present a novel inverse heat transfer method, which incorporates an automatic-filter scheme with the conjugate gradient method, for identifying shapes and temperature of heating elements embedded in a rectangular package. In this report, shapes of the heating elements are visualized by using node-matrix images. A group of unknown heating elements with different shapes, positions, and temperatures are nondestructively identified simply based on the data of the upper surface temperature of the rectangular package. Effects of temperature measurement uncertainty, grid size, and number of measurement points on the top surface on the identification accuracy are evaluated. Results show that the geometric and thermal conditions of the heating elements embedded can be predicted precisely by using the present approach. The approach is found to be stable and insensitive to the temperature measurement uncertainty, and without overwhelming mathematical manipulation, the form of objective function becomes flexible.

Original languageEnglish
Title of host publicationProceedings of 5th Electronics Packaging Technology Conference, EPTC 2003
EditorsMahadevan K. Iyer, Yew Cheong Mui, Kok Chuan Toh
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages611-619
Number of pages9
ISBN (Electronic)0780382056, 9780780382053
DOIs
Publication statusPublished - 2003 Jan 1
Event5th Electronics Packaging Technology Conference, EPTC 2003 - Singapore, Singapore
Duration: 2003 Dec 102003 Dec 12

Publication series

NameProceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Other

Other5th Electronics Packaging Technology Conference, EPTC 2003
CountrySingapore
CitySingapore
Period03-12-1003-12-12

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Cheng, C. H., & Chang, M. H. (2003). Predictions of shape and temperature for heating elements in an electronic package by inverse heat transfer method. In M. K. Iyer, Y. C. Mui, & K. C. Toh (Eds.), Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003 (pp. 611-619). [1271592] (Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2003.1271592