Preliminary study of an intelligent sampling decision scheme for the AVM system

Chun Fang Chen, Fan-Tien Cheng, Chu Chieh Wu, Hsuan Heng Huang

Research output: Contribution to journalConference article

1 Citation (Scopus)

Abstract

Wafer inspection plays a significant role in monitoring the quality of production wafers. However, it requires measuring tools and additional cycle time to do real metrology, which is costly and time-consuming. Therefore, reducing sampling rate to as low as possible is a high priority for many factories to reduce production cost. The most common way for inspecting process quality is to apply periodic sampling. If a manufacturing process is stable, then virtual metrology (VM) may be applied for monitoring the quality of wafers while real metrology is unavailable. Nevertheless, if a production variation occurs between periodic samplings, no real metrology is available during this period for updating the VM models, which may result in un-reliable VM predictions. The authors have developed the automatic virtual metrology (AVM) system for various VM applications. Therefore, this paper focuses on applying various indices of the AVM system to develop an Intelligent Sampling Decision (ISD) scheme for reducing sampling rate while VM accuracy is still sustained.

Original languageEnglish
Article number6907363
Pages (from-to)3496-3501
Number of pages6
JournalProceedings - IEEE International Conference on Robotics and Automation
DOIs
Publication statusPublished - 2014 Sep 22
Event2014 IEEE International Conference on Robotics and Automation, ICRA 2014 - Hong Kong, China
Duration: 2014 May 312014 Jun 7

Fingerprint

Sampling
Monitoring
Industrial plants
Inspection
Costs

All Science Journal Classification (ASJC) codes

  • Software
  • Control and Systems Engineering
  • Artificial Intelligence
  • Electrical and Electronic Engineering

Cite this

@article{2d9a8d0407aa4f19a06356f67991e186,
title = "Preliminary study of an intelligent sampling decision scheme for the AVM system",
abstract = "Wafer inspection plays a significant role in monitoring the quality of production wafers. However, it requires measuring tools and additional cycle time to do real metrology, which is costly and time-consuming. Therefore, reducing sampling rate to as low as possible is a high priority for many factories to reduce production cost. The most common way for inspecting process quality is to apply periodic sampling. If a manufacturing process is stable, then virtual metrology (VM) may be applied for monitoring the quality of wafers while real metrology is unavailable. Nevertheless, if a production variation occurs between periodic samplings, no real metrology is available during this period for updating the VM models, which may result in un-reliable VM predictions. The authors have developed the automatic virtual metrology (AVM) system for various VM applications. Therefore, this paper focuses on applying various indices of the AVM system to develop an Intelligent Sampling Decision (ISD) scheme for reducing sampling rate while VM accuracy is still sustained.",
author = "Chen, {Chun Fang} and Fan-Tien Cheng and Wu, {Chu Chieh} and Huang, {Hsuan Heng}",
year = "2014",
month = "9",
day = "22",
doi = "10.1109/ICRA.2014.6907363",
language = "English",
pages = "3496--3501",
journal = "Proceedings - IEEE International Conference on Robotics and Automation",
issn = "1050-4729",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

Preliminary study of an intelligent sampling decision scheme for the AVM system. / Chen, Chun Fang; Cheng, Fan-Tien; Wu, Chu Chieh; Huang, Hsuan Heng.

In: Proceedings - IEEE International Conference on Robotics and Automation, 22.09.2014, p. 3496-3501.

Research output: Contribution to journalConference article

TY - JOUR

T1 - Preliminary study of an intelligent sampling decision scheme for the AVM system

AU - Chen, Chun Fang

AU - Cheng, Fan-Tien

AU - Wu, Chu Chieh

AU - Huang, Hsuan Heng

PY - 2014/9/22

Y1 - 2014/9/22

N2 - Wafer inspection plays a significant role in monitoring the quality of production wafers. However, it requires measuring tools and additional cycle time to do real metrology, which is costly and time-consuming. Therefore, reducing sampling rate to as low as possible is a high priority for many factories to reduce production cost. The most common way for inspecting process quality is to apply periodic sampling. If a manufacturing process is stable, then virtual metrology (VM) may be applied for monitoring the quality of wafers while real metrology is unavailable. Nevertheless, if a production variation occurs between periodic samplings, no real metrology is available during this period for updating the VM models, which may result in un-reliable VM predictions. The authors have developed the automatic virtual metrology (AVM) system for various VM applications. Therefore, this paper focuses on applying various indices of the AVM system to develop an Intelligent Sampling Decision (ISD) scheme for reducing sampling rate while VM accuracy is still sustained.

AB - Wafer inspection plays a significant role in monitoring the quality of production wafers. However, it requires measuring tools and additional cycle time to do real metrology, which is costly and time-consuming. Therefore, reducing sampling rate to as low as possible is a high priority for many factories to reduce production cost. The most common way for inspecting process quality is to apply periodic sampling. If a manufacturing process is stable, then virtual metrology (VM) may be applied for monitoring the quality of wafers while real metrology is unavailable. Nevertheless, if a production variation occurs between periodic samplings, no real metrology is available during this period for updating the VM models, which may result in un-reliable VM predictions. The authors have developed the automatic virtual metrology (AVM) system for various VM applications. Therefore, this paper focuses on applying various indices of the AVM system to develop an Intelligent Sampling Decision (ISD) scheme for reducing sampling rate while VM accuracy is still sustained.

UR - http://www.scopus.com/inward/record.url?scp=84922753417&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84922753417&partnerID=8YFLogxK

U2 - 10.1109/ICRA.2014.6907363

DO - 10.1109/ICRA.2014.6907363

M3 - Conference article

AN - SCOPUS:84922753417

SP - 3496

EP - 3501

JO - Proceedings - IEEE International Conference on Robotics and Automation

JF - Proceedings - IEEE International Conference on Robotics and Automation

SN - 1050-4729

M1 - 6907363

ER -