Preparation of Cu1-xTax films and the material interaction in the Si/Cu1-xTax/Cu structure

Chien Tai Lin, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)


The present study investigated the microstructure of the Cu 1-xTax thin films and the material interaction in the Si/Cu1-xTax/Cu structure. The Cu1-xTa x thin films were prepared by a multitarget DC magnetron sputtering deposition and the deposit composition was controlled by the power applied to Cu and Ta targets. It was tried to investigate the effect of Cu and Ta contents on the crystallinity, electrical property, and adhesive characteristic of Cu1-xTax. The Cu1-xTax film shows an amorphous structure when Ta content is 72 at.% and above. Amorphous Cu 1-xTax is a good adhesive layer for Cu interconnection. The addition of Cu content decreases the resistivities of sputtered amorphous Cu1-xTax films. TaSi2 and η″-Cu 3Si nucleated during the sputtering deposition of Cu 1-xTax on the Si wafer and long-period superstructure η″-Cu3Si crystals grew with the annealing at 600 °C for 30 min. A mechanism for the formation of η″-Cu3Si in the Si/Cu1-xTax/Cu structure is described.

Original languageEnglish
Pages (from-to)306-315
Number of pages10
JournalMaterials Chemistry and Physics
Issue number2
Publication statusPublished - 2003 Nov 15

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics

Fingerprint Dive into the research topics of 'Preparation of Cu<sub>1-x</sub>Ta<sub>x</sub> films and the material interaction in the Si/Cu<sub>1-x</sub>Ta<sub>x</sub>/Cu structure'. Together they form a unique fingerprint.

Cite this