TY - GEN
T1 - Process and Structure Considerations for the Post FinFET Era
AU - Su, Chun Jung
AU - Sung, Po Jung
AU - Kao, Kuo Hsing
AU - Lee, Yao Jen
AU - Wu, Wen Fa
AU - Yeh, Wen Kuan
N1 - Funding Information:
This work was supported in part by the Ministry of Science and Technology, Taiwan, under Grant MOST-107-2628-E-492-001-MY3, 109-2923-E-492-002-MY3, 109-2639-E-009-001, 109-2634-F-009-029 and 109-2636-E-006-004. Also in part by financially supported by the “Center for the Semiconductor Technology Research” from The Featured Areas Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (MOE) in Taiwan. The authors would also like to thank the support of Hitachi High-Technologies Corp.
Publisher Copyright:
© 2020 IEEE.
PY - 2020/6
Y1 - 2020/6
N2 - Evolution of transistor structures, from planar, fin to gate-all-around (GAA) nanowire (NW)/nanosheet (NS), enables consecutive device scaling and performance boost. To further enhance the drive current per footprint, a vertically stacked configuration compatible with current CMOS technology may be a promising approach for extending Moore's Law. In this paper, we review the recent status of stacked FET architectures and beyond, as well as pointing out the challenges and perspectives.
AB - Evolution of transistor structures, from planar, fin to gate-all-around (GAA) nanowire (NW)/nanosheet (NS), enables consecutive device scaling and performance boost. To further enhance the drive current per footprint, a vertically stacked configuration compatible with current CMOS technology may be a promising approach for extending Moore's Law. In this paper, we review the recent status of stacked FET architectures and beyond, as well as pointing out the challenges and perspectives.
UR - http://www.scopus.com/inward/record.url?scp=85092177904&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85092177904&partnerID=8YFLogxK
U2 - 10.1109/SNW50361.2020.9131422
DO - 10.1109/SNW50361.2020.9131422
M3 - Conference contribution
AN - SCOPUS:85092177904
T3 - 2020 IEEE Silicon Nanoelectronics Workshop, SNW 2020
SP - 13
EP - 14
BT - 2020 IEEE Silicon Nanoelectronics Workshop, SNW 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE Silicon Nanoelectronics Workshop, SNW 2020
Y2 - 13 June 2020 through 14 June 2020
ER -