TY - GEN
T1 - Programmable System-on-chip (SoC) for silicon prototyping
AU - Huang, Chun Ming
AU - Wu, Chien Ming
AU - Yang, Chih Chyau
AU - Lee, Kuen Jong
AU - Wey, Chin Long
PY - 2008/12/29
Y1 - 2008/12/29
N2 - This paper presents a Programmable SoC (Systemon-chip) design methodology which integrates multiple heterogeneous SoC design projects into a single chip such that the total silicon prototyping cost for these projects can be greatly reduced by sharing the common SoC platform. Results show that an integrated SoC platform is comprised of eight SoC projects. When these eight SoC projects are designed separately, the total area is approximately 143.03mm2, while the area of the integrated platform is about 24.43mm2. The area reduction is significant, so is the fabrication cost. Once the integrated platform chip is fabricated, three programming schemes are carried out to allow the integrated chip to act as the individual SoC design projects. A test chip is designed and implemented using the TSMC 0.13um CMOS generic logic process technology. The development of second generation MP-SoC chip is also outlined in this paper.
AB - This paper presents a Programmable SoC (Systemon-chip) design methodology which integrates multiple heterogeneous SoC design projects into a single chip such that the total silicon prototyping cost for these projects can be greatly reduced by sharing the common SoC platform. Results show that an integrated SoC platform is comprised of eight SoC projects. When these eight SoC projects are designed separately, the total area is approximately 143.03mm2, while the area of the integrated platform is about 24.43mm2. The area reduction is significant, so is the fabrication cost. Once the integrated platform chip is fabricated, three programming schemes are carried out to allow the integrated chip to act as the individual SoC design projects. A test chip is designed and implemented using the TSMC 0.13um CMOS generic logic process technology. The development of second generation MP-SoC chip is also outlined in this paper.
UR - http://www.scopus.com/inward/record.url?scp=57849084520&partnerID=8YFLogxK
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U2 - 10.1109/ISIE.2008.4677107
DO - 10.1109/ISIE.2008.4677107
M3 - Conference contribution
AN - SCOPUS:57849084520
SN - 1424416655
SN - 9781424416653
T3 - IEEE International Symposium on Industrial Electronics
SP - 1976
EP - 1981
BT - 2008 IEEE International Symposium on Industrial Electronics, ISIE 2008
T2 - 2008 IEEE International Symposium on Industrial Electronics, ISIE 2008
Y2 - 30 June 2008 through 2 July 2008
ER -