Quantitative reliability prediction model for wafer level packages under board-level temperature cycling

Hung Chun Yang, Chin Li Kao, Tz Cheng Chiu, Chang Chi Lee, Sung Ching Hung, Chih Pin Hung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A damage accumulation based interconnect fatigue failure model is developed for predicting the board-level temperature cycling (T/C) reliability of wafer level packages (WLPs). Creep and constant strain rate experiments were first performed to characterize the viscoplastic constitutive behavior of Pb-free solder. Finite element (FE) analyses based on the viscoplastic models were conducted for estimating inelastic strain energy density accumulation. The numerical results were then compared to a library of board-level T/C reliability test results for best fitting the reliability model. Factors such as alloy Ag content, package geometry, and ball grid array (BGA) layout are considered in the model.

Original languageEnglish
Title of host publication2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publicationChallenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages325-328
Number of pages4
ISBN (Electronic)9781479977277
DOIs
Publication statusPublished - 2014 Jan 1
Event9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan
Duration: 2014 Oct 222014 Oct 24

Publication series

Name2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Other

Other9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
Country/TerritoryTaiwan
CityTaipei
Period14-10-2214-10-24

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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