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Reactive ion etching technique for via-hole applications in thick GaAs wafers
- Chih Cheng Wang
- , Yu Lu Lin
- , Shun Kuan Lin
- , Chun Sheng Li
- , Hou Kuei Huang
- , Chang Luen Wu
- , Chian Sern Chang
- , Yeong Her Wang
Research output: Contribution to journal › Article › peer-review
10
Citations
(Scopus)