Reactive wetting behaviors of Sn/Cu systems: A molecular dynamics study

J. Y. Hsieh, J. L. Chen, C. Chen, H. C. Lin, S. S. Yang, C. C. Hwang

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Influences of temperature and Sn-Cu droplet's composition on reactive wettings of Cu(100), Cu(110), and Cu(111) surfaces were analyzed, by using molecular dynamics (MD) calculations. As a result, the spreading on Cu(110)(Cu(100)) has the fastest (slowest) wetting kinetics. A higher temperature or a diluter Cu content in the Sn-Cu alloy droplet results in a higher wettability. Moreover, this work has addressed a theory for positioning the interface separating the liquidus and solidus alloys in the spreading film to confirm the hypothesis that the reactive wetting will come to the end when the interface saturates with the temperature-dependent solidus weight fraction of Cu.

Original languageEnglish
Pages (from-to)60-67
Number of pages8
JournalNano-Micro Letters
Volume2
Issue number2
DOIs
Publication statusPublished - 2010 Jan 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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