Recrystallization of Ag and Ag-La alloy wire in wire bonding process

Hao Wen Hsueh, Fei Yi Hung, Truan Sheng Lui

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Sliver wire was the novel material to replaced gold wire in wire bonding process, and rare earth element was often added to improve the properties of silver wires. The annealing effect (at 225°C~275°C for 30min) on the tensile mechanical properties of silver wires with φ=20μm was investigated. In addition, the microstructural characteristics and the mechanical properties before and after an electric flame-off (EFO) process were also studied. Free-air ball (FAB) of 85μm diameter from 20μm diameter pure silver wire was too huge for bonding process, otherwise the silver wire was added 0.05 wt.% lanthanum to form Ag-La alloy wire to reduce the diameter of FAB. FAB of Ag-La alloy wire with a 55μm diameter, and can avoid short-circuited. In addition, microstructures, tensile properties and the micro-hardness of Ag-La alloy wires indicated that the best annealing temperature was 425°C.

Original languageEnglish
Title of host publicationMaterials and Measurement
Pages151-157
Number of pages7
DOIs
Publication statusPublished - 2013
Event2013 International Conference on Intelligent Materials and Measurement, ICIMM 2013 - , Singapore
Duration: 2013 Jul 272013 Jul 28

Publication series

NameAdvanced Materials Research
Volume804
ISSN (Print)1022-6680

Other

Other2013 International Conference on Intelligent Materials and Measurement, ICIMM 2013
CountrySingapore
Period13-07-2713-07-28

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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