Reduction of IC Package Warpage through Finite Element Analysis and Direct Optimization

Roberto Louis Moran, Emmanuel Arriola, Nino Rigo Emil Lim, John Patrick Mercado, Richard Dimagiba, Jeremias Gonzaga, Aristotle Ubando

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Warpage due to thermal stresses in IC packaging is a current challenge for the semiconductor manufacturing industry. This study uses FEM coupled with a direct optimization to reduce warpage in an AMB IC package. ANSYS Static Structural module was set to predict the warpage of an active metal brazed (AMB) ceramic substrate composite material when undergoing thermal cycling during manufacturing. It was then coupled with the Direct Optimization module of Design Explorer. The DO changes dimensions and features in the composite material, within restrictions set, in search for the best configurations that will counter warpage. The results show that, when reducing warpage induced by channels or cuts on the AMB face, mirroring the channel patterns on the opposite side of the AMB reduces resulting warpage by 92%.

Original languageEnglish
Title of host publication2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728130446
DOIs
Publication statusPublished - 2019 Nov
Event11th IEEE International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019 - Laoag, Philippines
Duration: 2019 Nov 292019 Dec 1

Publication series

Name2019 IEEE 11th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019

Conference

Conference11th IEEE International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management, HNICEM 2019
CountryPhilippines
CityLaoag
Period19-11-2919-12-01

All Science Journal Classification (ASJC) codes

  • Artificial Intelligence
  • Computer Networks and Communications
  • Computer Science Applications
  • Information Systems and Management
  • Electrical and Electronic Engineering
  • Management, Monitoring, Policy and Law
  • Control and Optimization

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