Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps

Kwang Lung Lin, Yi Cheng Liu

Research output: Contribution to journalArticlepeer-review

22 Citations (Scopus)

Abstract

Materials interaction, shearing strength, and bump growth of Al/Cu/electroless nickel/Sn-Pb solder bumps were investigated with respect to reflow conditions. Shearing strength of the solder bump is as high as 64 g/bump for a bump pad dimension of 100×100 m. Reflow temperature enhances the shearing strength while repeating reflow downgrades the shearing strength to a lowest value of 35 g/bump. A greater bump height is achieved when reflow was conducted at a slower heating rate. Cu penetrates the electroless nickel (EN) layer after reflow, while Al remains unmoved. The diffusion behavior of Cu through the EN layer is discussed. Ni-Sn and Cu-Sn intermetallic compounds form during reflow.

Original languageEnglish
Pages (from-to)568-574
Number of pages7
JournalIEEE Transactions on Advanced Packaging
Volume22
Issue number4
DOIs
Publication statusPublished - 1999

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps'. Together they form a unique fingerprint.

Cite this