Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps

Kwang-Lung Lin, Yi Cheng Liu

Research output: Contribution to journalArticle

21 Citations (Scopus)

Abstract

Materials interaction, shearing strength, and bump growth of Al/Cu/electroless nickel/Sn-Pb solder bumps were investigated with respect to reflow conditions. Shearing strength of the solder bump is as high as 64 g/bump for a bump pad dimension of 100×100 m. Reflow temperature enhances the shearing strength while repeating reflow downgrades the shearing strength to a lowest value of 35 g/bump. A greater bump height is achieved when reflow was conducted at a slower heating rate. Cu penetrates the electroless nickel (EN) layer after reflow, while Al remains unmoved. The diffusion behavior of Cu through the EN layer is discussed. Ni-Sn and Cu-Sn intermetallic compounds form during reflow.

Original languageEnglish
Pages (from-to)568-574
Number of pages7
JournalIEEE Transactions on Advanced Packaging
Volume22
Issue number4
DOIs
Publication statusPublished - 1999 Dec 1

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Shearing
Soldering alloys
Nickel
Heating rate
Intermetallics
Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

@article{536d6657f6594230a3348464aba3c3cf,
title = "Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps",
abstract = "Materials interaction, shearing strength, and bump growth of Al/Cu/electroless nickel/Sn-Pb solder bumps were investigated with respect to reflow conditions. Shearing strength of the solder bump is as high as 64 g/bump for a bump pad dimension of 100×100 m. Reflow temperature enhances the shearing strength while repeating reflow downgrades the shearing strength to a lowest value of 35 g/bump. A greater bump height is achieved when reflow was conducted at a slower heating rate. Cu penetrates the electroless nickel (EN) layer after reflow, while Al remains unmoved. The diffusion behavior of Cu through the EN layer is discussed. Ni-Sn and Cu-Sn intermetallic compounds form during reflow.",
author = "Kwang-Lung Lin and Liu, {Yi Cheng}",
year = "1999",
month = "12",
day = "1",
doi = "10.1109/6040.803447",
language = "English",
volume = "22",
pages = "568--574",
journal = "IEEE Transactions on Advanced Packaging",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "4",

}

Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps. / Lin, Kwang-Lung; Liu, Yi Cheng.

In: IEEE Transactions on Advanced Packaging, Vol. 22, No. 4, 01.12.1999, p. 568-574.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps

AU - Lin, Kwang-Lung

AU - Liu, Yi Cheng

PY - 1999/12/1

Y1 - 1999/12/1

N2 - Materials interaction, shearing strength, and bump growth of Al/Cu/electroless nickel/Sn-Pb solder bumps were investigated with respect to reflow conditions. Shearing strength of the solder bump is as high as 64 g/bump for a bump pad dimension of 100×100 m. Reflow temperature enhances the shearing strength while repeating reflow downgrades the shearing strength to a lowest value of 35 g/bump. A greater bump height is achieved when reflow was conducted at a slower heating rate. Cu penetrates the electroless nickel (EN) layer after reflow, while Al remains unmoved. The diffusion behavior of Cu through the EN layer is discussed. Ni-Sn and Cu-Sn intermetallic compounds form during reflow.

AB - Materials interaction, shearing strength, and bump growth of Al/Cu/electroless nickel/Sn-Pb solder bumps were investigated with respect to reflow conditions. Shearing strength of the solder bump is as high as 64 g/bump for a bump pad dimension of 100×100 m. Reflow temperature enhances the shearing strength while repeating reflow downgrades the shearing strength to a lowest value of 35 g/bump. A greater bump height is achieved when reflow was conducted at a slower heating rate. Cu penetrates the electroless nickel (EN) layer after reflow, while Al remains unmoved. The diffusion behavior of Cu through the EN layer is discussed. Ni-Sn and Cu-Sn intermetallic compounds form during reflow.

UR - http://www.scopus.com/inward/record.url?scp=0033310566&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0033310566&partnerID=8YFLogxK

U2 - 10.1109/6040.803447

DO - 10.1109/6040.803447

M3 - Article

VL - 22

SP - 568

EP - 574

JO - IEEE Transactions on Advanced Packaging

JF - IEEE Transactions on Advanced Packaging

SN - 1521-3323

IS - 4

ER -