Abstract
This paper presents a regenerative surface polishing methodology to improve the quality of surface flatness. All possible surface defects produced by traditional grinding operations are carefully reviewed. These defects include some permanent non-uniform vacant areas, pitting-spots, scratching tracks, burnouts, and the quenching-breakage. To alleviate these traditional grinding defects, the paper presents a new approach by designing and constructed a regenerative surface polishing system which includes a mechanism that carries the workpart submerged in a oil-contained open box. The spindle-held polishing tool is moved in relative to the workpart by a combined motion of cycloid, linear feed and lateral travel. The motion trajectory for polishing operations is derived and optimized based upon the quality index of contact uniformity and homogeneity as expressed in terms of contact frequency for each point on the polished surface. The analytical kinematics model thus derived is used to conduct numerical simulation for characterizing the optimal working range of each key polishing parameter. Once the working range of each polishing parameter is obtained, the motion to generate the optimal ranges of each key parameter is generated and superposed. Based upon the results obtained from theoretical studies, a working machine is designed and built. Several experiments are carried.
Original language | English |
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Pages (from-to) | 95-103 |
Number of pages | 9 |
Journal | Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao |
Volume | 25 |
Issue number | 2 |
Publication status | Published - 2004 Apr |
All Science Journal Classification (ASJC) codes
- Mechanical Engineering