| Original language | English |
|---|---|
| Pages (from-to) | D19-D21 |
| Journal | ECS Electrochemistry Letters |
| Volume | 2 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2013 Jan 29 |
Cite this
@article{a59a1919bdd545b0adb40df45878c070,
title = "Relationship between Parent and Twin Orientations in Pulse Electrodeposited Copper",
author = "Y.-w. Lin and J.-c. Kuo",
year = "2013",
month = "1",
day = "29",
doi = "10.1149/2.006304eel",
language = "English",
volume = "2",
pages = "D19--D21",
journal = "ECS Electrochemistry Letters",
issn = "2162-8726",
publisher = "The Electrochemical Society",
number = "4",
}
Lin, Y & Kuo, J 2013, 'Relationship between Parent and Twin Orientations in Pulse Electrodeposited Copper', ECS Electrochemistry Letters, vol. 2, no. 4, pp. D19-D21. https://doi.org/10.1149/2.006304eel
Relationship between Parent and Twin Orientations in Pulse Electrodeposited Copper. / Lin, Y.-w.; Kuo, J.-c.
In: ECS Electrochemistry Letters, Vol. 2, No. 4, 29.01.2013, p. D19-D21.Research output: Contribution to journal › Article
TY - JOUR
T1 - Relationship between Parent and Twin Orientations in Pulse Electrodeposited Copper
AU - Lin, Y.-w.
AU - Kuo, J.-c.
PY - 2013/1/29
Y1 - 2013/1/29
U2 - 10.1149/2.006304eel
DO - 10.1149/2.006304eel
M3 - Article
VL - 2
SP - D19-D21
JO - ECS Electrochemistry Letters
JF - ECS Electrochemistry Letters
SN - 2162-8726
IS - 4
ER -