Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load

Tz-Cheng Chiu, Jyun Ji Lin, Hung Chun Yang, Vikas Gupta

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The ever increasing power density in high performance microelectronic devices for applications such as large business computing and telecommunication infrastructure has led to several new reliability challenges for solder interconnects. One of them is the creep collapse and bridging of ball grid array (BGA) solder joints under heatsink compressive loads. For characterizing the solder joint response to compressive load and model the corresponding reliability failure, the compressive creep behavior of Sn3.8Ag0.7Cu solder was first investigated. A viscoplastic constitutive model developed from the creep characterization was then incorporated into numerical finite element (FE) analysis to predict solder joint creep collapse and bridging under heatsink compressive load. The numerical analysis results were validated by experimental studies of solder joint collapse under compressive load and isothermal aging condition. A simplified power-law formula is also provided for modeling the creep collapse of Sn3.8Ag0.7Cu solder joint. The model may be applied for predicting solder joint compressive reliability under a prescribed heatsink compression, or to determine the maximum allowable heatsink load for a given life expectancy.

Original languageEnglish
Pages (from-to)2037-2050
Number of pages14
JournalMicroelectronics Reliability
Volume50
Issue number12
DOIs
Publication statusPublished - 2010 Dec 1

Fingerprint

Ball grid arrays
solders
Soldering alloys
balls
grids
Creep
Constitutive models
microelectronics
Microelectronics
numerical analysis
Telecommunication
telecommunication
radiant flux density
Numerical analysis
Compaction
Aging of materials
Finite element method

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Chiu, Tz-Cheng ; Lin, Jyun Ji ; Yang, Hung Chun ; Gupta, Vikas. / Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load. In: Microelectronics Reliability. 2010 ; Vol. 50, No. 12. pp. 2037-2050.
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Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load. / Chiu, Tz-Cheng; Lin, Jyun Ji; Yang, Hung Chun; Gupta, Vikas.

In: Microelectronics Reliability, Vol. 50, No. 12, 01.12.2010, p. 2037-2050.

Research output: Contribution to journalArticle

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