Physics & Astronomy
silanes
76%
residual stress
64%
oxide films
63%
cracks
54%
vapor deposition
54%
stress measurement
42%
fracture mechanics
41%
bows
40%
microelectromechanical systems
34%
tendencies
31%
film thickness
28%
wafers
26%
engineering
26%
hydrogen
21%
fabrication
21%
annealing
21%
temperature
20%
predictions
18%
gases
18%
Engineering & Materials Science
Plasma enhanced chemical vapor deposition
100%
Silanes
90%
Oxide films
87%
Residual stresses
61%
Cracks
31%
Stress measurement
28%
Temperature
28%
Film thickness
25%
Fracture mechanics
23%
Annealing
23%
MEMS
21%
Hydrogen
18%
Gases
13%
Hot Temperature
11%
Chemical Compounds
Residual Stress
93%
Plasma Enhanced Chemical Vapour Deposition
84%
Oxide
38%
Liquid Film
34%
Fracture Mechanics
26%
Annealing
13%
Gas
9%
Hydrogen
8%