Residual stress release during nanoindentation-induced delamination

Huu Hung Nguyen, Pal Jen Wei, Jen Fin Lin

Research output: Contribution to journalArticle

Abstract

This study proposed a new method to determine residual stresses through delamination induced by cyclic indentation loads. For the silicon oxide film indented by a cube corner indenter, sudden increase of indentation depth, together with a particular two-stage behavior, suggests that delamination occurred. After that, contact stiffness divided by depth was found to drop from an initial value to a steady value, which is independent of load conditions and is related to the release of residual stress. Similar phenomena were found in diamond-like carbon films tested by the continuous stiffness measurements using a Berkovich indenter, and the proposed method was applied to obtain the residual stresses of the as-deposited and annealed films. The dimensionless parameters related to the indenter geometry were determined to be 2.61±0.03 and 5.63±0.06 for a cube corner and a Berkovich indenter, respectively. The later one showed good agreement compared to the reported value from the simulation analysis.

Original languageEnglish
Pages (from-to)836-838
Number of pages3
JournalAdvanced Science Letters
Volume8
DOIs
Publication statusPublished - 2012 Aug 2

All Science Journal Classification (ASJC) codes

  • Computer Science(all)
  • Health(social science)
  • Mathematics(all)
  • Education
  • Environmental Science(all)
  • Engineering(all)
  • Energy(all)

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