Resonant Vibration Behavior of Lead-Free Solders

J. M. Song; T. S. Lui; L. H. Chen; D. Y. Tsai

doi:10.1007/s11664-003-0121-3

Resonant Vibration Behavior of Lead-Free Solders

J. M. Song, T. S. Lui, L. H. Chen, D. Y. Tsai

Research output: Contribution to journal › Article › peer-review

15 Citations (Scopus)

Abstract

This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.

Original language	English
Pages (from-to)	1501-1508
Number of pages	8
Journal	Journal of Electronic Materials
Volume	32
Issue number	12
DOIs	https://doi.org/10.1007/s11664-003-0121-3
Publication status	Published - 2003 Jan 2

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-003-0121-3

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@article{2be262c15acc4a60979092a493ba3dd0,

title = "Resonant Vibration Behavior of Lead-Free Solders",

abstract = "This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.",

author = "Song, {J. M.} and Lui, {T. S.} and Chen, {L. H.} and Tsai, {D. Y.}",

note = "Funding Information: This work has been supported by the Chinese National Science Council under Contract No. NSC 91-2216-E-006-054 for which the authors are grateful.",

year = "2003",

month = jan,

day = "2",

doi = "10.1007/s11664-003-0121-3",

language = "English",

volume = "32",

pages = "1501--1508",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "12",

}

TY - JOUR

T1 - Resonant Vibration Behavior of Lead-Free Solders

AU - Song, J. M.

AU - Lui, T. S.

AU - Chen, L. H.

AU - Tsai, D. Y.

N1 - Funding Information: This work has been supported by the Chinese National Science Council under Contract No. NSC 91-2216-E-006-054 for which the authors are grateful.

PY - 2003/1/2

Y1 - 2003/1/2

N2 - This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.

AB - This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.

UR - http://www.scopus.com/inward/record.url?scp=0942266957&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0942266957&partnerID=8YFLogxK

U2 - 10.1007/s11664-003-0121-3

DO - 10.1007/s11664-003-0121-3

M3 - Article

AN - SCOPUS:0942266957

VL - 32

SP - 1501

EP - 1508

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 12

ER -

Resonant Vibration Behavior of Lead-Free Solders

Abstract

All Science Journal Classification (ASJC) codes

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