Abstract
This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.
| Original language | English |
|---|---|
| Pages (from-to) | 1501-1508 |
| Number of pages | 8 |
| Journal | Journal of Electronic Materials |
| Volume | 32 |
| Issue number | 12 |
| DOIs | |
| Publication status | Published - 2003 Jan 2 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry
Cite this
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Resonant Vibration Behavior of Lead-Free Solders. / Song, J. M.; Lui, Truan-Sheng; Chen, L. H.; Tsai, D. Y.
In: Journal of Electronic Materials, Vol. 32, No. 12, 02.01.2003, p. 1501-1508.Research output: Contribution to journal › Article
TY - JOUR
T1 - Resonant Vibration Behavior of Lead-Free Solders
AU - Song, J. M.
AU - Lui, Truan-Sheng
AU - Chen, L. H.
AU - Tsai, D. Y.
PY - 2003/1/2
Y1 - 2003/1/2
N2 - This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.
AB - This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.
UR - http://www.scopus.com/inward/record.url?scp=0942266957&partnerID=8YFLogxK
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U2 - 10.1007/s11664-003-0121-3
DO - 10.1007/s11664-003-0121-3
M3 - Article
VL - 32
SP - 1501
EP - 1508
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
SN - 0361-5235
IS - 12
ER -