Resonant Vibration Behavior of Lead-Free Solders

J. M. Song; T. S. Lui; L. H. Chen; D. Y. Tsai

doi:10.1007/s11664-003-0121-3

Resonant Vibration Behavior of Lead-Free Solders

J. M. Song, T. S. Lui, L. H. Chen, D. Y. Tsai

Research output: Contribution to journal › Article

15 Citations (Scopus)

Abstract

This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn, Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved.

Original language	English
Pages (from-to)	1501-1508
Number of pages	8
Journal	Journal of Electronic Materials
Volume	32
Issue number	12
DOIs	https://doi.org/10.1007/s11664-003-0121-3
Publication status	Published - 2003 Jan 2

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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AU - Lui, T. S.

AU - Chen, L. H.

AU - Tsai, D. Y.

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