Reversibility of creep-fatigue damage in 63Sn-37Pb solder

Shen-Haw Ju, B. I. Sandor

Research output: Contribution to conferencePaperpeer-review

1 Citation (Scopus)

Abstract

This paper explores the reversibility of damage in 63Sn-37Pb solder using bimaterial shear experiments. We have first demonstrated the reversibility of damage due to compression, which has been qualitatively known in the general fatigue area, but has not been quantitatively investigated using modern models. The reversibility of damage in shear is not nearly so obvious, because the fracture behaviors in tension-compression and cyclic shear are usually different. In our bimaterial shear experiments, the specimen is two pieces of copper joined by a layer of 63Sn-37Pb solder with a thickness of 1 mm (0.04 in.). The applied loading is a trapezoidal wave shape with various hold times. An extensometer is used to measure the cyclic displacement between the two copper plates. The results of experiments indicate that the reversible damage effect plays an important role in the failure of solder under cyclic shear stress. This phenomenon is not considered in current isotropic or anisotropic continuum damage mechanics; therefore, it is necessary to generate a reversible-damage theory for solder materials. Incorporating this theory in the finite element method, we can better predict fatigue life and crack growth paths for a complex solder joint under complex loads.

Original languageEnglish
Pages1069-1072
Number of pages4
Publication statusPublished - 1995 Jan 1
EventProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA
Duration: 1995 Mar 261995 Mar 30

Other

OtherProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)
CityMaui, HI, USA
Period95-03-2695-03-30

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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