@inproceedings{b874fc691e1848dca5c8fa02605a3d2d,
title = "RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications",
abstract = "To preserve delicate quantum signals (few hundreds to a few tens of μV), low-loss and low-crosstalk inter-dielet communication is a must in a wafer-scale integrated quantum system using Superconducting-IF. In this paper, inter-dielet links (short: 125 μm and 500 μm; long: 1750 μm) with L/S (2/2 and 5/5 μm) are characterized in a broadband 20 GHz range through simulation and experiments at 4K A compact assembly (inter-dielet spacing of 100 μm) through the quantum-compatible fine-pitch (10 um) Au interlayer is conducted. For insertion loss and crosstalk characterization, the simulated and measured results are presented to be low-loss (<1 dB) and low-crosstalk (< -23 dB) in the broadband 20 GHz range with short (≤ 500 um) and long (1750 um) links and two L/S (2/2 and 5/5 um). It is one of the first 20 GHz broadband RF characterization of short superconducting links (≤ 500 um) through advanced packaging for cryogenic inter-dielet quantum communication. This work brings large-scale quantum computing closer to being realized through compact heterogeneous integration.",
author = "Yang, {Yu Tao} and Haoxiang Ren and Chong, {Su Kong} and Gang Qiu and Ku, {Shu Yun} and Yang Cheng and Chaowei Hu and Tiema Qian and Chen, {Kuan Neng} and Ni Ni and Wang, {Kang L.} and Iyer, {Subramanian S.}",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 72nd IEEE Electronic Components and Technology Conference, ECTC 2022 ; Conference date: 31-05-2022 Through 03-06-2022",
year = "2022",
doi = "10.1109/ECTC51906.2022.00154",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "949--955",
booktitle = "Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022",
address = "United States",
}