TY - JOUR
T1 - Rice husk-derived porous carbon/silica particles as green filler for electronic package application
AU - Hsieh, Ya Yu
AU - Chen, Tsung Yi
AU - Kuo, Wei Chiao
AU - Lai, Yi Shao
AU - Yang, Ping Feng
AU - Lin, Hong Ping
N1 - Publisher Copyright:
© 2016 Wiley Periodicals, Inc.
PY - 2017/4/15
Y1 - 2017/4/15
N2 - Bio-based porous carbon/silica particles (denoted as RH-carbon/silica) were successfully prepared from agricultural waste rice husk by using acid-hydrothermal treatment and pyrolysis under nitrogen condition. As green filler, the cure behavior, thermal-mechanical properties, and thermal conductivity of the epoxy-carbon/silica biocomposites at different filler contents (5, 9, 17, 29 wt %) were characterized. Because of superior surface properties (surface area, porosity, and silica segment) and high content of carbon component in the RH-carbon/silica, the characteristics of the biocomposites were significantly improved with the increase of the filler content. At 29 wt % of filler content, the epoxy biocomposites exhibit lower curing temperature (148 °C), lower CTE (42 ppm/°C), higher Tg (123 °C), higher storage modulus (4059 MPa), and higher effective thermal conductivity (0.29 W/mK). In brief, the RH-carbon/silica particles that can serve not only as reinforcing agent but also as thermal transport medium used in epoxy composite, is a green and high-performance filler for this purpose.
AB - Bio-based porous carbon/silica particles (denoted as RH-carbon/silica) were successfully prepared from agricultural waste rice husk by using acid-hydrothermal treatment and pyrolysis under nitrogen condition. As green filler, the cure behavior, thermal-mechanical properties, and thermal conductivity of the epoxy-carbon/silica biocomposites at different filler contents (5, 9, 17, 29 wt %) were characterized. Because of superior surface properties (surface area, porosity, and silica segment) and high content of carbon component in the RH-carbon/silica, the characteristics of the biocomposites were significantly improved with the increase of the filler content. At 29 wt % of filler content, the epoxy biocomposites exhibit lower curing temperature (148 °C), lower CTE (42 ppm/°C), higher Tg (123 °C), higher storage modulus (4059 MPa), and higher effective thermal conductivity (0.29 W/mK). In brief, the RH-carbon/silica particles that can serve not only as reinforcing agent but also as thermal transport medium used in epoxy composite, is a green and high-performance filler for this purpose.
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U2 - 10.1002/app.44699
DO - 10.1002/app.44699
M3 - Article
AN - SCOPUS:85007454008
SN - 0021-8995
VL - 134
JO - Journal of Applied Polymer Science
JF - Journal of Applied Polymer Science
IS - 15
M1 - 44699
ER -