Abstract
This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.
Original language | English |
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Pages (from-to) | 1249-1254 |
Number of pages | 6 |
Journal | Journal of Electronic Materials |
Volume | 34 |
Issue number | 9 |
DOIs | |
Publication status | Published - 2005 Sep |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry