Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Jenn Ming Song; Pei Chi Liu; Chia Ling Shih; Kwang Lung Lin

doi:10.1007/s11664-005-0270-7

Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Jenn Ming Song, Pei Chi Liu, Chia Ling Shih, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

43 Citations (Scopus)

Abstract

This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag₅Zn₈ form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn₃ from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn₃ is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

Original language	English
Pages (from-to)	1249-1254
Number of pages	6
Journal	Journal of Electronic Materials
Volume	34
Issue number	9
DOIs	https://doi.org/10.1007/s11664-005-0270-7
Publication status	Published - 2005 Sep

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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abstract = "This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.",

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AU - Liu, Pei Chi

AU - Shih, Chia Ling

AU - Lin, Kwang Lung

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AB - This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

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