Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Jenn Ming Song, Pei Chi Liu, Chia Ling Shih, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

43 Citations (Scopus)

Abstract

This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

Original languageEnglish
Pages (from-to)1249-1254
Number of pages6
JournalJournal of Electronic Materials
Volume34
Issue number9
DOIs
Publication statusPublished - 2005 Sep

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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