Routability-Driven Orientation-Aware Analytical Placement for System in Package

Jai Ming Lin; Tsung Chun Tsai; Rui Ting Shen

doi:10.1109/ICCAD57390.2023.10323927

Routability-Driven Orientation-Aware Analytical Placement for System in Package

Jai Ming Lin
, Tsung Chun Tsai
, Rui Ting Shen

Department of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

As the challenge of advanced process in ICs increases, system in package (SiP for short) has played a more important role in the semiconductor industry. SiP has several advantages such as heterogeneous integration, lower manufacturing and development cost, and better reliability of preventing mechanical stress. In order to obtain high quality SiP, component placement is the most important stage in an SiP design, and its result not only determines wirelength but also has a great impact on routability. Hence, this paper proposes the first placement algorithm to consider routabiltiy by the analytical formulation for SiP. Furthermore, to obtain the accurate orientations of components, we propose two models by the softmax function to estimate wirelength and density precisely. However, in order to consider the 135 degree routing nets, we also propose a new model to estimate routing overflow to reduce routing congestion by our analytical placement. Experimental results show that our SiP placement algorithm with the proposed models can obtain better results than other works.

Original language	English
Title of host publication	2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9798350315592
DOIs	https://doi.org/10.1109/ICCAD57390.2023.10323927
Publication status	Published - 2023
Event	42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - San Francisco, United States Duration: 2023 Oct 28 → 2023 Nov 2

Publication series

Name	IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)	1092-3152

Conference

Conference	42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023
Country/Territory	United States
City	San Francisco
Period	23-10-28 → 23-11-02

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

All Science Journal Classification (ASJC) codes

Software
Computer Science Applications
Computer Graphics and Computer-Aided Design

Access to Document

10.1109/ICCAD57390.2023.10323927

Cite this

Lin, J. M., Tsai, T. C., & Shen, R. T. (2023). Routability-Driven Orientation-Aware Analytical Placement for System in Package. In 2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCAD57390.2023.10323927

Lin, Jai Ming ; Tsai, Tsung Chun ; Shen, Rui Ting. / Routability-Driven Orientation-Aware Analytical Placement for System in Package. 2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2023. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

@inproceedings{6200e1df6efd4f01b7c70de1c07827fa,

title = "Routability-Driven Orientation-Aware Analytical Placement for System in Package",

abstract = "As the challenge of advanced process in ICs increases, system in package (SiP for short) has played a more important role in the semiconductor industry. SiP has several advantages such as heterogeneous integration, lower manufacturing and development cost, and better reliability of preventing mechanical stress. In order to obtain high quality SiP, component placement is the most important stage in an SiP design, and its result not only determines wirelength but also has a great impact on routability. Hence, this paper proposes the first placement algorithm to consider routabiltiy by the analytical formulation for SiP. Furthermore, to obtain the accurate orientations of components, we propose two models by the softmax function to estimate wirelength and density precisely. However, in order to consider the 135 degree routing nets, we also propose a new model to estimate routing overflow to reduce routing congestion by our analytical placement. Experimental results show that our SiP placement algorithm with the proposed models can obtain better results than other works.",

author = "Lin, \{Jai Ming\} and Tsai, \{Tsung Chun\} and Shen, \{Rui Ting\}",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 ; Conference date: 28-10-2023 Through 02-11-2023",

year = "2023",

doi = "10.1109/ICCAD57390.2023.10323927",

language = "English",

series = "IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings",

address = "United States",

}

Lin, JM, Tsai, TC & Shen, RT 2023, Routability-Driven Orientation-Aware Analytical Placement for System in Package. in 2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings. IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD, Institute of Electrical and Electronics Engineers Inc., 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023, San Francisco, United States, 23-10-28. https://doi.org/10.1109/ICCAD57390.2023.10323927

Routability-Driven Orientation-Aware Analytical Placement for System in Package. / Lin, Jai Ming; Tsai, Tsung Chun; Shen, Rui Ting.
2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2023. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Routability-Driven Orientation-Aware Analytical Placement for System in Package

AU - Lin, Jai Ming

AU - Tsai, Tsung Chun

AU - Shen, Rui Ting

PY - 2023

Y1 - 2023

N2 - As the challenge of advanced process in ICs increases, system in package (SiP for short) has played a more important role in the semiconductor industry. SiP has several advantages such as heterogeneous integration, lower manufacturing and development cost, and better reliability of preventing mechanical stress. In order to obtain high quality SiP, component placement is the most important stage in an SiP design, and its result not only determines wirelength but also has a great impact on routability. Hence, this paper proposes the first placement algorithm to consider routabiltiy by the analytical formulation for SiP. Furthermore, to obtain the accurate orientations of components, we propose two models by the softmax function to estimate wirelength and density precisely. However, in order to consider the 135 degree routing nets, we also propose a new model to estimate routing overflow to reduce routing congestion by our analytical placement. Experimental results show that our SiP placement algorithm with the proposed models can obtain better results than other works.

AB - As the challenge of advanced process in ICs increases, system in package (SiP for short) has played a more important role in the semiconductor industry. SiP has several advantages such as heterogeneous integration, lower manufacturing and development cost, and better reliability of preventing mechanical stress. In order to obtain high quality SiP, component placement is the most important stage in an SiP design, and its result not only determines wirelength but also has a great impact on routability. Hence, this paper proposes the first placement algorithm to consider routabiltiy by the analytical formulation for SiP. Furthermore, to obtain the accurate orientations of components, we propose two models by the softmax function to estimate wirelength and density precisely. However, in order to consider the 135 degree routing nets, we also propose a new model to estimate routing overflow to reduce routing congestion by our analytical placement. Experimental results show that our SiP placement algorithm with the proposed models can obtain better results than other works.

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M3 - Conference contribution

AN - SCOPUS:85181399271

T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

BT - 2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

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ER -

Lin JM, Tsai TC, Shen RT. Routability-Driven Orientation-Aware Analytical Placement for System in Package. In 2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2023. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD). doi: 10.1109/ICCAD57390.2023.10323927

Routability-Driven Orientation-Aware Analytical Placement for System in Package

Abstract

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