RUSM: Harnessing Unused Resources in 3D NAND SSD to Enhance Reading Performance

Hasan Alhasan, Yun Chih Chen, Chien Chung Ho, Tei Wei Kuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

3D NAND flash-based storage devices, i.e., Solid-State Drives (SSDs), are gradually regarded as promising candidates to lead the flash industry thanks to their rapidly growing density. However, 3D NAND SSD has relatively high flash command latency, which raises the phenomenon of chip-blocking write, yielding the read long-tail latency problem. Data replication is a viable strategy for increasing data availability. However, data replication brings extra time overhead to read and write data, which reinforces the original chip-blocking write problem. We first reveal that the conventional scheme writes a whole page to flush smaller data portion, resulting into time squandering. Based on this observation, we propose a novel scheme, RUSM (Replicate Using Subpage Merging), which reclaims the improperly used time from the conventional page writing operation to amend the replication mechanism. Through experiments, we show how RUSM controls the chip-blocking write problem and enhances reading performance at low overhead cost.

Original languageEnglish
Title of host publicationProceedings - 2022 IEEE 11th Non-Volatile Memory Systems and Applications Symposium, NVMSA 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages63-68
Number of pages6
ISBN (Electronic)9781665450782
DOIs
Publication statusPublished - 2022
Event11th IEEE Non-Volatile Memory Systems and Applications Symposium, NVMSA 2022 - Taipei, Taiwan
Duration: 2022 Aug 232022 Aug 25

Publication series

NameProceedings - 2022 IEEE 11th Non-Volatile Memory Systems and Applications Symposium, NVMSA 2022

Conference

Conference11th IEEE Non-Volatile Memory Systems and Applications Symposium, NVMSA 2022
Country/TerritoryTaiwan
CityTaipei
Period22-08-2322-08-25

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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