TY - GEN
T1 - SAINT
T2 - 35th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2016
AU - Lin, Jai Ming
AU - Chiu, Po Yang
AU - Chang, Yen Fu
N1 - Publisher Copyright:
© 2016 ACM.
PY - 2016/11/7
Y1 - 2016/11/7
N2 - Three-dimensional integrated circuits (3D ICs) offer significant improvements over two-dimensional circuits in several aspects. Classic 3D floorplanning algorithm places each module at one single die. However, power consumption and wirelength of a 3D IC may be further reduced if it contains folding modules or stack modules such as stack memory. Hence, this paper proposes a fixed-outline 3D floorplanning algorithm which can simultaneously handle different kinds of modules such as soft modules, hard modules, folding modules, and stack modules. In order to maintain the shape of a 3D module, our algorithm aligns the sub-modules of a folding (or stack) module such that they have identical coordinates in respective dies. Experimental results have demonstrated efficiency and effectiveness of our approach even in large benchmarks such as IBM circuits.
AB - Three-dimensional integrated circuits (3D ICs) offer significant improvements over two-dimensional circuits in several aspects. Classic 3D floorplanning algorithm places each module at one single die. However, power consumption and wirelength of a 3D IC may be further reduced if it contains folding modules or stack modules such as stack memory. Hence, this paper proposes a fixed-outline 3D floorplanning algorithm which can simultaneously handle different kinds of modules such as soft modules, hard modules, folding modules, and stack modules. In order to maintain the shape of a 3D module, our algorithm aligns the sub-modules of a folding (or stack) module such that they have identical coordinates in respective dies. Experimental results have demonstrated efficiency and effectiveness of our approach even in large benchmarks such as IBM circuits.
UR - https://www.scopus.com/pages/publications/85000963135
UR - https://www.scopus.com/pages/publications/85000963135#tab=citedBy
U2 - 10.1145/2966986.2967071
DO - 10.1145/2966986.2967071
M3 - Conference contribution
AN - SCOPUS:85000963135
T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
BT - 2016 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2016
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 7 November 2016 through 10 November 2016
ER -