Abstract
This paper reports on the effect of screen printed metallization on the passivation quality of a boron doped poly-Si/SiO x passivated contact (PC) structure composed of a very thin Si oxide (∼15 Å) capped with boron doped poly-Si. Our boron doped poly-Si/SiO x passivated contact (p-Poly Si/SiO x PC) with a SiN x capping layer gave excellent surface passivation with a very low saturation current density of ∼5 fA/cm 2 . After screen printed metallization on poly-Si with a metal coverage of ∼10%, this value increased to ∼17 fA/cm 2 . This paper also demonstrates the fabrication of screen printed, large area (239 cm 2 ), high efficiency (∼21%) n-base bifacial back junction Si solar cells with p-Poly-Si/SiO x PC on the rear and a phosphorus implanted n ++ -n + selective front surface field. Detailed analysis is performed to quantify recombination and extract the saturation current density contributions (J 0 ) from each layer of the cell including the metallized front surface field and the tunnel oxide passivated contact. Finally, 2D device modeling of this back junction cell is performed by implementing a simple approach which replaces the p-Poly-Si/SiO x PC by an equivalent p-n junction with the same J 0 and gives a good match between the measured and simulated cell parameters using the extracted J 0 and recombination velocity values.
Original language | English |
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Article number | 263901 |
Journal | Applied Physics Letters |
Volume | 113 |
Issue number | 26 |
DOIs | |
Publication status | Published - 2018 Dec 24 |
All Science Journal Classification (ASJC) codes
- Physics and Astronomy (miscellaneous)