Self-assembled monolayer coating for non-stick encapsulation mold

Ya Yu Hsieh, Yi Shao Lai, Shu-Hui Chen

Research output: Contribution to journalShort survey

Abstract

A major factor that affects the reliability and production yield of green packages is the adhesion between green molding compound and encapsulation mold. The non-stick coating on molds by physical vapor deposition (PVD) has been regarded as an alternative of the environmentally-unfriendly electroplated hard-Cr coating but its cost is high. In this paper, we report a self-assembled monolayer (SAM) technique that uses methacryloxypropyl trimethoxysilane (MPTMS) as the coupling agent for photo crosslinking to form a dense and durable anti-stick film on the encapsulation mold surface. The presence of the coated MPTMS thin film was identified by the X-ray photoelectron spectroscopy (XPS). Hydrophobicity and roughness of the film were analyzed through contact angle measurement and 3D optical imaging profiler, respectively. Mold releasing tests show that the MPTMS coating has a better mold releasing capability than electroplating hard-Cr and PVD CrN coatings.

Original languageEnglish
JournalAdvancing Microelectronics
Volume35
Issue number3
Publication statusPublished - 2008 May 1

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Self assembled monolayers
Encapsulation
Physical vapor deposition
Coatings
Hard coatings
Sheet molding compounds
Coupling agents
Molds
Electroplating
Hydrophobicity
Angle measurement
Crosslinking
Contact angle
Adhesion
X ray photoelectron spectroscopy
Surface roughness
Imaging techniques
Thin films
Costs

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

@article{4deeeb5fef9c4fe09f88de2aedb0f689,
title = "Self-assembled monolayer coating for non-stick encapsulation mold",
abstract = "A major factor that affects the reliability and production yield of green packages is the adhesion between green molding compound and encapsulation mold. The non-stick coating on molds by physical vapor deposition (PVD) has been regarded as an alternative of the environmentally-unfriendly electroplated hard-Cr coating but its cost is high. In this paper, we report a self-assembled monolayer (SAM) technique that uses methacryloxypropyl trimethoxysilane (MPTMS) as the coupling agent for photo crosslinking to form a dense and durable anti-stick film on the encapsulation mold surface. The presence of the coated MPTMS thin film was identified by the X-ray photoelectron spectroscopy (XPS). Hydrophobicity and roughness of the film were analyzed through contact angle measurement and 3D optical imaging profiler, respectively. Mold releasing tests show that the MPTMS coating has a better mold releasing capability than electroplating hard-Cr and PVD CrN coatings.",
author = "Hsieh, {Ya Yu} and Lai, {Yi Shao} and Shu-Hui Chen",
year = "2008",
month = "5",
day = "1",
language = "English",
volume = "35",
journal = "Advancing Microelectronics",
issn = "2222-8748",
publisher = "IMAPS-International Microelectronics and Packaging Society",
number = "3",

}

Self-assembled monolayer coating for non-stick encapsulation mold. / Hsieh, Ya Yu; Lai, Yi Shao; Chen, Shu-Hui.

In: Advancing Microelectronics, Vol. 35, No. 3, 01.05.2008.

Research output: Contribution to journalShort survey

TY - JOUR

T1 - Self-assembled monolayer coating for non-stick encapsulation mold

AU - Hsieh, Ya Yu

AU - Lai, Yi Shao

AU - Chen, Shu-Hui

PY - 2008/5/1

Y1 - 2008/5/1

N2 - A major factor that affects the reliability and production yield of green packages is the adhesion between green molding compound and encapsulation mold. The non-stick coating on molds by physical vapor deposition (PVD) has been regarded as an alternative of the environmentally-unfriendly electroplated hard-Cr coating but its cost is high. In this paper, we report a self-assembled monolayer (SAM) technique that uses methacryloxypropyl trimethoxysilane (MPTMS) as the coupling agent for photo crosslinking to form a dense and durable anti-stick film on the encapsulation mold surface. The presence of the coated MPTMS thin film was identified by the X-ray photoelectron spectroscopy (XPS). Hydrophobicity and roughness of the film were analyzed through contact angle measurement and 3D optical imaging profiler, respectively. Mold releasing tests show that the MPTMS coating has a better mold releasing capability than electroplating hard-Cr and PVD CrN coatings.

AB - A major factor that affects the reliability and production yield of green packages is the adhesion between green molding compound and encapsulation mold. The non-stick coating on molds by physical vapor deposition (PVD) has been regarded as an alternative of the environmentally-unfriendly electroplated hard-Cr coating but its cost is high. In this paper, we report a self-assembled monolayer (SAM) technique that uses methacryloxypropyl trimethoxysilane (MPTMS) as the coupling agent for photo crosslinking to form a dense and durable anti-stick film on the encapsulation mold surface. The presence of the coated MPTMS thin film was identified by the X-ray photoelectron spectroscopy (XPS). Hydrophobicity and roughness of the film were analyzed through contact angle measurement and 3D optical imaging profiler, respectively. Mold releasing tests show that the MPTMS coating has a better mold releasing capability than electroplating hard-Cr and PVD CrN coatings.

UR - http://www.scopus.com/inward/record.url?scp=49249096636&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=49249096636&partnerID=8YFLogxK

M3 - Short survey

AN - SCOPUS:49249096636

VL - 35

JO - Advancing Microelectronics

JF - Advancing Microelectronics

SN - 2222-8748

IS - 3

ER -