Silicon-package-board co-design for the eye diagram prediction of a 3Gbps HDMI transmitter

Chung Ming Huang; Wei Da Guo; Chia Re Shen; Chih Chung Tsai

doi:10.1109/VLDI-DAT.2013.6533856

Silicon-package-board co-design for the eye diagram prediction of a 3Gbps HDMI transmitter

Chung Ming Huang, Wei Da Guo, Chia Re Shen, Chih Chung Tsai

Department of Computer Science and Information Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In the design of high-speed transmitter, eye diagram is widely recognized as the most critical specification. For the highspeed data rate higher than 2Gbps, the eye opening would be very sensitive to the system design, such as PCB, connector, package, and so on. To fast converge the inevitable design iteration, a silicon-package-board (SPB) co-design methodology is required for accurate prediction of the output eye diagram. A 3Gbps HDMI transmitter design for display of 4K2K resolution is proposed based on the SPB co-simulation with well-extracted system models. The measured eye diagram at 3Gbps passed the compliance test specification (CTS) and is well correlated to the post-layout simulation result.

Original language	English
Title of host publication	2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013
DOIs	https://doi.org/10.1109/VLDI-DAT.2013.6533856
Publication status	Published - 2013
Event	2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013 - Hsinchu, Taiwan Duration: 2013 Apr 22 → 2013 Apr 24

Publication series

Name	2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013

Other

Other	2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013
Country/Territory	Taiwan
City	Hsinchu
Period	13-04-22 → 13-04-24

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/VLDI-DAT.2013.6533856

Cite this

Huang, C. M., Guo, W. D., Shen, C. R., & Tsai, C. C. (2013). Silicon-package-board co-design for the eye diagram prediction of a 3Gbps HDMI transmitter. In 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013 Article 6533856 (2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013). https://doi.org/10.1109/VLDI-DAT.2013.6533856

@inproceedings{1a00dde9fb1b43289f1502cc2173b394,

title = "Silicon-package-board co-design for the eye diagram prediction of a 3Gbps HDMI transmitter",

abstract = "In the design of high-speed transmitter, eye diagram is widely recognized as the most critical specification. For the highspeed data rate higher than 2Gbps, the eye opening would be very sensitive to the system design, such as PCB, connector, package, and so on. To fast converge the inevitable design iteration, a silicon-package-board (SPB) co-design methodology is required for accurate prediction of the output eye diagram. A 3Gbps HDMI transmitter design for display of 4K2K resolution is proposed based on the SPB co-simulation with well-extracted system models. The measured eye diagram at 3Gbps passed the compliance test specification (CTS) and is well correlated to the post-layout simulation result.",

author = "Huang, {Chung Ming} and Guo, {Wei Da} and Shen, {Chia Re} and Tsai, {Chih Chung}",

year = "2013",

doi = "10.1109/VLDI-DAT.2013.6533856",

language = "English",

isbn = "9781467344357",

series = "2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013",

booktitle = "2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013",

note = "2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013 ; Conference date: 22-04-2013 Through 24-04-2013",

}

Huang, CM, Guo, WD, Shen, CR & Tsai, CC 2013, Silicon-package-board co-design for the eye diagram prediction of a 3Gbps HDMI transmitter. in 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013., 6533856, 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, 2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013, Hsinchu, Taiwan, 13-04-22. https://doi.org/10.1109/VLDI-DAT.2013.6533856

Silicon-package-board co-design for the eye diagram prediction of a 3Gbps HDMI transmitter. / Huang, Chung Ming; Guo, Wei Da; Shen, Chia Re et al.
2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013. 2013. 6533856 (2013 International Symposium on VLSI Design, Automation, and Test, VLSI-DAT 2013).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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N2 - In the design of high-speed transmitter, eye diagram is widely recognized as the most critical specification. For the highspeed data rate higher than 2Gbps, the eye opening would be very sensitive to the system design, such as PCB, connector, package, and so on. To fast converge the inevitable design iteration, a silicon-package-board (SPB) co-design methodology is required for accurate prediction of the output eye diagram. A 3Gbps HDMI transmitter design for display of 4K2K resolution is proposed based on the SPB co-simulation with well-extracted system models. The measured eye diagram at 3Gbps passed the compliance test specification (CTS) and is well correlated to the post-layout simulation result.

AB - In the design of high-speed transmitter, eye diagram is widely recognized as the most critical specification. For the highspeed data rate higher than 2Gbps, the eye opening would be very sensitive to the system design, such as PCB, connector, package, and so on. To fast converge the inevitable design iteration, a silicon-package-board (SPB) co-design methodology is required for accurate prediction of the output eye diagram. A 3Gbps HDMI transmitter design for display of 4K2K resolution is proposed based on the SPB co-simulation with well-extracted system models. The measured eye diagram at 3Gbps passed the compliance test specification (CTS) and is well correlated to the post-layout simulation result.

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Y2 - 22 April 2013 through 24 April 2013

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Silicon-package-board co-design for the eye diagram prediction of a 3Gbps HDMI transmitter

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