Silicon strength testing for mesoscale structural applications

Kuo Shen Chen, Arturo A. Ayon, S. Mark Spearing

Research output: Contribution to journalConference articlepeer-review

5 Citations (Scopus)

Abstract

Strength characterization and supporting analysis of mesoscale biaxial flexure and radiused hub flexure single crystal silicon specimens were conducted. The Weibull reference strength of planar biaxial flexure specimens was found to lie in the range 1.2 to 4.6 GPa. The local strength at stress concentrations was obtained by testing radiused hub flexure specimens. For the case of deep reactive ion etched (DRIE) specimens, the strength at fillet radii was significantly lower than that measured from planar biaxial flexure specimens due to the inferior surface quality in such regions. Further, it was found that strength could be significantly increased by the introduction of an additional isotropic etch after the DRIE step.

Original languageEnglish
Pages (from-to)123-130
Number of pages8
JournalMaterials Research Society Symposium - Proceedings
Volume518
DOIs
Publication statusPublished - 1998
EventProceedings of the 1998 MRS Spring Symposium - San Francisco, CA, USA
Duration: 1998 Apr 151998 Apr 16

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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