Silicon strength testing for mesoscale structural applications

Kuo Shen Chen; Arturo A. Ayon; S. Mark Spearing

doi:10.1557/proc-518-123

Silicon strength testing for mesoscale structural applications

Kuo Shen Chen, Arturo A. Ayon, S. Mark Spearing

Department of Mechanical Engineering

Research output: Contribution to journal › Conference article › peer-review

6 Citations (Scopus)

Abstract

Strength characterization and supporting analysis of mesoscale biaxial flexure and radiused hub flexure single crystal silicon specimens were conducted. The Weibull reference strength of planar biaxial flexure specimens was found to lie in the range 1.2 to 4.6 GPa. The local strength at stress concentrations was obtained by testing radiused hub flexure specimens. For the case of deep reactive ion etched (DRIE) specimens, the strength at fillet radii was significantly lower than that measured from planar biaxial flexure specimens due to the inferior surface quality in such regions. Further, it was found that strength could be significantly increased by the introduction of an additional isotropic etch after the DRIE step.

Original language	English
Pages (from-to)	123-130
Number of pages	8
Journal	Materials Research Society Symposium - Proceedings
Volume	518
DOIs	https://doi.org/10.1557/proc-518-123
Publication status	Published - 1998
Event	Proceedings of the 1998 MRS Spring Symposium - San Francisco, CA, USA Duration: 1998 Apr 15 → 1998 Apr 16

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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title = "Silicon strength testing for mesoscale structural applications",

abstract = "Strength characterization and supporting analysis of mesoscale biaxial flexure and radiused hub flexure single crystal silicon specimens were conducted. The Weibull reference strength of planar biaxial flexure specimens was found to lie in the range 1.2 to 4.6 GPa. The local strength at stress concentrations was obtained by testing radiused hub flexure specimens. For the case of deep reactive ion etched (DRIE) specimens, the strength at fillet radii was significantly lower than that measured from planar biaxial flexure specimens due to the inferior surface quality in such regions. Further, it was found that strength could be significantly increased by the introduction of an additional isotropic etch after the DRIE step.",

author = "Chen, {Kuo Shen} and Ayon, {Arturo A.} and Spearing, {S. Mark}",

year = "1998",

doi = "10.1557/proc-518-123",

language = "English",

volume = "518",

pages = "123--130",

journal = "Materials Research Society Symposium - Proceedings",

issn = "0272-9172",

publisher = "Materials Research Society",

note = "Proceedings of the 1998 MRS Spring Symposium ; Conference date: 15-04-1998 Through 16-04-1998",

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TY - JOUR

T1 - Silicon strength testing for mesoscale structural applications

AU - Chen, Kuo Shen

AU - Ayon, Arturo A.

AU - Spearing, S. Mark

PY - 1998

Y1 - 1998

N2 - Strength characterization and supporting analysis of mesoscale biaxial flexure and radiused hub flexure single crystal silicon specimens were conducted. The Weibull reference strength of planar biaxial flexure specimens was found to lie in the range 1.2 to 4.6 GPa. The local strength at stress concentrations was obtained by testing radiused hub flexure specimens. For the case of deep reactive ion etched (DRIE) specimens, the strength at fillet radii was significantly lower than that measured from planar biaxial flexure specimens due to the inferior surface quality in such regions. Further, it was found that strength could be significantly increased by the introduction of an additional isotropic etch after the DRIE step.

AB - Strength characterization and supporting analysis of mesoscale biaxial flexure and radiused hub flexure single crystal silicon specimens were conducted. The Weibull reference strength of planar biaxial flexure specimens was found to lie in the range 1.2 to 4.6 GPa. The local strength at stress concentrations was obtained by testing radiused hub flexure specimens. For the case of deep reactive ion etched (DRIE) specimens, the strength at fillet radii was significantly lower than that measured from planar biaxial flexure specimens due to the inferior surface quality in such regions. Further, it was found that strength could be significantly increased by the introduction of an additional isotropic etch after the DRIE step.

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DO - 10.1557/proc-518-123

M3 - Conference article

AN - SCOPUS:0032291693

SN - 0272-9172

VL - 518

SP - 123

EP - 130

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Proceedings of the 1998 MRS Spring Symposium

Y2 - 15 April 1998 through 16 April 1998

ER -

Silicon strength testing for mesoscale structural applications

Abstract

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