TY - GEN
T1 - Simulation and characterization of a high-sensitive micro-opto-mechanical Microphone
AU - Gao, H.
AU - Huang, C. H.
AU - Westerveld, W.
AU - Haouari, R.
AU - Troia, B.
AU - Verhaegen, F.
AU - Jansen, R.
AU - Figeys, B.
AU - Rottenberg, X.
AU - Rochus, V.
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/5/30
Y1 - 2018/5/30
N2 - Micro-opto-mechanical Microphone (MOMM) based on integrated optical Mach-Zehnder interferometers (MZI) are promising for future application in medical environments. However, the design of next generation MOMM systems on chip remains challenging due to the intrinsic multi-physics characteristics related to acoustic, mechanical, optical and electrical effects. We therefore developed a methodology composed of acoustic, mechanic, optical, and electronic sections for fast design of high performance MOMM systems. The feasibility has been demonstrated as the operational characteristics of the fabricated MOMM (i.e. resonance frequency, dynamic range, the sensitivity and SNR) align well with the measured references.
AB - Micro-opto-mechanical Microphone (MOMM) based on integrated optical Mach-Zehnder interferometers (MZI) are promising for future application in medical environments. However, the design of next generation MOMM systems on chip remains challenging due to the intrinsic multi-physics characteristics related to acoustic, mechanical, optical and electrical effects. We therefore developed a methodology composed of acoustic, mechanic, optical, and electronic sections for fast design of high performance MOMM systems. The feasibility has been demonstrated as the operational characteristics of the fabricated MOMM (i.e. resonance frequency, dynamic range, the sensitivity and SNR) align well with the measured references.
UR - http://www.scopus.com/inward/record.url?scp=85048851715&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85048851715&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2018.8369932
DO - 10.1109/EuroSimE.2018.8369932
M3 - Conference contribution
AN - SCOPUS:85048851715
T3 - 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
SP - 1
EP - 4
BT - 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
Y2 - 15 April 2018 through 18 April 2018
ER -