Simulation and fabrication for pin-to-plate microjoining by Nd:YAG laser

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This paper reports the behavior of pin-to-plate microjoining using the pulsed Nd:YAG laser in the approaches of numerical simulation and metallurgical analysis. A three-dimensional pin-to-plate finite element model has been developed to analyze the transient temperature field and thermal stress distribution during the fabrication process of the laser joint to find a better joining condition. The thermal history of the plate was recorded during the joining process to verify the result of the finite element approach. Metallurgical analysis was done to understand microstructure transformation after joining. The result shows that the micro-pin can be successfully joined to the thin plate in the applied condition using CF50-2 commercial filler alloy. The numerical result is also in good agreement with experimental measurements after joining fabrication.

Original languageEnglish
Pages (from-to)104-109
Number of pages6
JournalMicrosystem Technologies
Volume12
Issue number1-2 SPEC. ISS.
DOIs
Publication statusPublished - 2005 Dec 1

Fingerprint

Joining
YAG lasers
Fabrication
fabrication
Lasers
simulation
thin plates
thermal stresses
fillers
Thermal stress
stress distribution
Fillers
Stress concentration
pulsed lasers
Temperature distribution
temperature distribution
histories
microstructure
Microstructure
Computer simulation

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

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title = "Simulation and fabrication for pin-to-plate microjoining by Nd:YAG laser",
abstract = "This paper reports the behavior of pin-to-plate microjoining using the pulsed Nd:YAG laser in the approaches of numerical simulation and metallurgical analysis. A three-dimensional pin-to-plate finite element model has been developed to analyze the transient temperature field and thermal stress distribution during the fabrication process of the laser joint to find a better joining condition. The thermal history of the plate was recorded during the joining process to verify the result of the finite element approach. Metallurgical analysis was done to understand microstructure transformation after joining. The result shows that the micro-pin can be successfully joined to the thin plate in the applied condition using CF50-2 commercial filler alloy. The numerical result is also in good agreement with experimental measurements after joining fabrication.",
author = "Chen-Kuei Chung and Yu-Cheng Lin",
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Simulation and fabrication for pin-to-plate microjoining by Nd:YAG laser. / Chung, Chen-Kuei; Lin, Yu-Cheng.

In: Microsystem Technologies, Vol. 12, No. 1-2 SPEC. ISS., 01.12.2005, p. 104-109.

Research output: Contribution to journalArticle

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