Abstract
This paper reports the behavior of pin-to-plate microjoining using the pulsed Nd:YAG laser in the approaches of numerical simulation and metallurgical analysis. A three-dimensional pin-to-plate finite element model has been developed to analyze the transient temperature field and thermal stress distribution during the fabrication process of the laser joint to find a better joining condition. The thermal history of the plate was recorded during the joining process to verify the result of the finite element approach. Metallurgical analysis was done to understand microstructure transformation after joining. The result shows that the micro-pin can be successfully joined to the thin plate in the applied condition using CF50-2 commercial filler alloy. The numerical result is also in good agreement with experimental measurements after joining fabrication.
| Original language | English |
|---|---|
| Pages (from-to) | 104-109 |
| Number of pages | 6 |
| Journal | Microsystem Technologies |
| Volume | 12 |
| Issue number | 1-2 SPEC. ISS. |
| DOIs | |
| Publication status | Published - 2005 Dec 1 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Hardware and Architecture
- Electrical and Electronic Engineering
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Simulation and fabrication for pin-to-plate microjoining by Nd:YAG laser. / Chung, Chen-Kuei; Lin, Yu-Cheng.
In: Microsystem Technologies, Vol. 12, No. 1-2 SPEC. ISS., 01.12.2005, p. 104-109.Research output: Contribution to journal › Article
TY - JOUR
T1 - Simulation and fabrication for pin-to-plate microjoining by Nd:YAG laser
AU - Chung, Chen-Kuei
AU - Lin, Yu-Cheng
PY - 2005/12/1
Y1 - 2005/12/1
N2 - This paper reports the behavior of pin-to-plate microjoining using the pulsed Nd:YAG laser in the approaches of numerical simulation and metallurgical analysis. A three-dimensional pin-to-plate finite element model has been developed to analyze the transient temperature field and thermal stress distribution during the fabrication process of the laser joint to find a better joining condition. The thermal history of the plate was recorded during the joining process to verify the result of the finite element approach. Metallurgical analysis was done to understand microstructure transformation after joining. The result shows that the micro-pin can be successfully joined to the thin plate in the applied condition using CF50-2 commercial filler alloy. The numerical result is also in good agreement with experimental measurements after joining fabrication.
AB - This paper reports the behavior of pin-to-plate microjoining using the pulsed Nd:YAG laser in the approaches of numerical simulation and metallurgical analysis. A three-dimensional pin-to-plate finite element model has been developed to analyze the transient temperature field and thermal stress distribution during the fabrication process of the laser joint to find a better joining condition. The thermal history of the plate was recorded during the joining process to verify the result of the finite element approach. Metallurgical analysis was done to understand microstructure transformation after joining. The result shows that the micro-pin can be successfully joined to the thin plate in the applied condition using CF50-2 commercial filler alloy. The numerical result is also in good agreement with experimental measurements after joining fabrication.
UR - http://www.scopus.com/inward/record.url?scp=30344462086&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=30344462086&partnerID=8YFLogxK
U2 - 10.1007/s00542-005-0001-2
DO - 10.1007/s00542-005-0001-2
M3 - Article
AN - SCOPUS:30344462086
VL - 12
SP - 104
EP - 109
JO - Microsystem Technologies
JF - Microsystem Technologies
SN - 0946-7076
IS - 1-2 SPEC. ISS.
ER -