Simulation and fabrication for pin-to-plate microjoining by Nd:YAG laser

This paper reports the behavior of pin-to-plate microjoining using the pulsed Nd:YAG laser in the approaches of numerical simulation and metallurgical analysis. A three-dimensional pin-to-plate finite element model has been developed to analyze the transient temperature field and thermal stress distribution during the fabrication process of the laser joint to find a better joining condition. The thermal history of the plate was recorded during the joining process to verify the result of the finite element approach. Metallurgical analysis was done to understand microstructure transformation after joining. The result shows that the micro-pin can be successfully joined to the thin plate in the applied condition using CF50-2 commercial filler alloy. The numerical result is also in good agreement with experimental measurements after joining fabrication.