TY - GEN
T1 - Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging
AU - Teng, Shiang Yu
AU - Hwang, Sheng Jye
PY - 2005
Y1 - 2005
N2 - Warpage is an important issue for IC packages after molding. Due to laminated structure of IC packages, significant warpage occurs owing to differences in shrinkage among constituent materials. Thermal shrinkage is usually considered as the main cause for IC warpage. However, cure induced warpage is also important during the molding process. Analysis without considering cure induced shrinkage can not predict the amount of warpage well. In this paper, TSOP LOC54L package product, which is manufactured by ChipMos Corporation, is used as the simulation model. The P-V-T-C (Pressure, Volume, Temperature, and Conversion) relation and CTE (Coefficients of Thermal Expansion) of an encapsulation material are used to predict the amount of warpage and experimentally verifying the results in this study. By comparing the simulations with the experiments, the preliminary results of the study indicate this approach is capable of estimating warpage in IC packages without prohibitive computational effort.
AB - Warpage is an important issue for IC packages after molding. Due to laminated structure of IC packages, significant warpage occurs owing to differences in shrinkage among constituent materials. Thermal shrinkage is usually considered as the main cause for IC warpage. However, cure induced warpage is also important during the molding process. Analysis without considering cure induced shrinkage can not predict the amount of warpage well. In this paper, TSOP LOC54L package product, which is manufactured by ChipMos Corporation, is used as the simulation model. The P-V-T-C (Pressure, Volume, Temperature, and Conversion) relation and CTE (Coefficients of Thermal Expansion) of an encapsulation material are used to predict the amount of warpage and experimentally verifying the results in this study. By comparing the simulations with the experiments, the preliminary results of the study indicate this approach is capable of estimating warpage in IC packages without prohibitive computational effort.
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U2 - 10.1115/ipack2005-73062
DO - 10.1115/ipack2005-73062
M3 - Conference contribution
AN - SCOPUS:32844458995
SN - 0791842002
SN - 9780791842003
T3 - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
SP - 867
EP - 872
BT - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
PB - American Society of Mechanical Engineers
T2 - ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Y2 - 17 July 2005 through 22 July 2005
ER -