Simulations and experiments of three-dimensional paddle shift for IC packaging

Shiang Yu Teng, Sheng Jye Hwang

Research output: Contribution to journalArticlepeer-review

27 Citations (Scopus)


Paddle shift is one of the most serious defects which may arise during the IC encapsulation of leadframe-type packages. The term "paddle shift" means the deflection of the leadframe-pad and die as a result of the pressure difference between the top and bottom mold cavities. In extreme cases, paddle shift could lead to a substantial reduction in the reliability of package. This paper employed a computational approach to predict the paddle shift quantity during the IC packaging process. The approach was based on precise finite element (FE) models and flow-structure decoupled analyses. Two kinds of FE models were needed for the decoupled analyses, namely a 3D FE model for the mold filling analysis (i.e. fluid-flow mesh) and a 3D FE model for the structural analysis (i.e. paddle mesh). The aim of the mold filling analysis was to identify the pressure distribution acting on the paddle structure during the encapsulation process, while the objective of the structural analysis was to determine the amount of paddle shift which was caused by pressure distribution. To investigate the relationship between the package geometry and the amount of paddle shift, the present simulations considered six TQFP (Thin quad flat package) models with different geometrical parameters. The simulation results for the paddle shift were compared with the experimental results to demonstrate the accuracy of the proposed numerical approach. It was found that a good agreement exists between the two sets of results.

Original languageEnglish
Pages (from-to)115-125
Number of pages11
JournalMicroelectronic Engineering
Issue number1
Publication statusPublished - 2008 Jan

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering


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